Semiconductor device and manufacturing method thereof
View Patent ↗A method of manufacturing a semiconductor device including forming a trench on a first surface of a silicon substrate, forming a thermal oxide layer and a deposited oxide layer on the trench and the silicon substrate, planarizing a second surface of the silicon substrate by a chemical mechanical polishing (CMP) process, and forming a transistor on the second surface of the silicon substrate. The semiconductor device and the method of manufacturing the same provide an SOI device that has low resistance of the source/drain regions and suppress a short channel effect.
1. A method of manufacturing a semiconductor device, comprising:
forming a trench on a first surface of a silicon substrate;
forming a thermal oxide layer on the trench and the silicon substrate;
depositing an oxide layer on the trench and the silicon substrate;
overturning the silicon substrate;
planarizing a second surface of the silicon substrate by a chemical mechanical polishing (CMP) process; and
forming a transistor on the second surface of the silicon substrate wherein the forming of the transistor comprises:
forming a gate electrode on the second surface of the silicon substrate over the trench;
forming extended source and drain regions on the second surface of the silicon substrate by implanting ions using the gate electrode as an implantation mask;
forming a pair of spacers on the sidewalls of the gate electrode; and
forming source and drain regions by implanting ions using the gate electrode and the spacers as an implantation mask,
wherein the extended source and drain regions formed on the second surface extend towards the trench and are located in between the gate electrode and the trench; and
said gate electrode is located directly above the trench.
2. The method of claim 1 , wherein a depth of the extended source/drain regions are shallower than that of the source and drain regions.
3. The method of claim 1 , wherein a channel region of the transistor is formed between the gate electrode and the trench.
4. The method of claim 1 , wherein the oxide layer fills the trench.
5. The method of claim 1 , wherein a spacing distance between a bottom of the trench and the planarized second surface of the silicon substrate is 100 to 500 Å.
6. The method of claim 1 , wherein a spacing distance between a bottom of the trench and the planarized second surface of the silicon substrate is 500 to 50,000 Å.
7. A method of manufacturing a semiconductor device, comprising:
forming a trench on a first surface of a silicon substrate;
forming a thermal oxide layer on the trench and the silicon substrate;
depositing an oxide layer on the trench and the silicon substrate;
overturning the silicon substrate;
planarizing a second surface of the silicon substrate by a chemical mechanical polishing (CMP) process; and
forming a transistor on the second surface of the silicon substrate, wherein the forming of the transistor comprises:
forming a gate electrode on the second surface of the silicon substrate over the trench;
forming extended source and drain regions on the second surface of the silicon substrate by implanting ions using the gate electrode as an implantation mask;
forming a pair of spacers on the sidewalls of the gate electrode;
forming source and drain regions by implanting ions using the gate electrode and the spacers as an implantation mask; and
said extended source and drain regions have a depth lesser than a depth of the source and drain region said spacer divides the extended source and drain regions from the source and drain regions.
8. The method of claim 7 , wherein a combined width of the gate electrode, the sidewalls, and the spacer, is equal to a combined width of the extended source and drain regions and the channel region.
9. The method of claim 7 , wherein the source and drain regions are located below and exterior to the gate electrode and the spacer.