IP Library Patent Application 11320466
Patent Application
App. No. 11/320,466

Wafer transfer apparatus having two independently movable transfer modules

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Quick Facts
Patent No.
US None
App. No.
11/320,466
Abstract

A wafer transfer apparatus having two independently movable transfer modules. The apparatus that transfers the wafers from one chamber to another includes a first transfer module and a second transfer module. Each module has a robot arm and at least one blade. Each robot arm freely rotates along the chambers, and each blade is rotatably connected to the robot arm. The first and second transfer modules move independently in same or different directions. Each transfer module may have two blades, which are joined respectively to upper and lower parts of the robot arm. Furthermore, the first and second transfer modules can maintain an angle of at least one hundred twenty degrees, whereby preventing the wafers from being overlapped in transit.

Claims (6)

1 . A wafer transfer apparatus that transfers wafers from one chamber to another in a wafer fabrication equipment having a plurality of chambers, the apparatus comprising:

a first transfer module having a first robot arm and at least one first blade, the first robot arm freely rotating along the chambers, and the first blade being rotatably connected to the first robot arm; and

a second transfer module having a second robot arm and at least one second blade, the second robot arm freely rotating along the chambers, and the second blade being rotatably connected to the second robot arm,

wherein the first and second transfer modules move independently in same or different directions.

2 . The apparatus of claim 1 , wherein each transfer module has two blades, which are joined respectively to upper and lower parts of the robot arm.

3 . The apparatus of claim 1 , wherein the first and second transfer modules maintain an angle of at least one hundred twenty degrees, whereby preventing the wafers from being overlapped in transit.

Assignments (2)
CHANGE OF NAME Recorded May 23, 2006
From: DONGBU-ANAM SEMICONDUCTOR, INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017663/0468 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 6, 2006
From: LEE, JAE SUK; LEE, JUNE WOO
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017756/0737 →