Fabrication system and fabrication method
View Patent ↗A fabricating method for a system including a plurality of processing apparatuses connected to each other by an inter-apparatus transporter. The semiconductor waters are processed in the processing apparatuses and are transported to specified processing apparatuses in different time interval that are set to N times a unit time interval. Since the fabricating system includes processing apparatuses and an inter-apparatus transporter that are periodically controlled at time intervals related to a unit time, intervals related to a unit time, the scheduling of a plurality of works can be made efficiently to enhance the level of optimization, thus improving the productivity.
1. A fabricating method for a fabricating system including at least first and second processing apparatuses each being provided with at least a processing chamber and an interface for loading and unloading a plurality of semiconductor wafers contained in a carrier, an inter-apparatus transporter, and at least one computer storing managing information of processing and transporting of the semiconductor wafers comprising the steps of:
processing a plurality of the semiconductor wafers contained in first carrier by the first processing apparatus with a predetermined process condition according to the managing information; and
processing a plurality of the semiconductor wafers contained in second carrier by the second processing apparatus with a predetermined process condition according to the managing information; and
starting to transport said first carrier containing the plurality of the semiconductor wafers having been processed and waiting for transportation in the first processing apparatus toward the second processing apparatus by the inter-apparatus transporter prior to unloading of the second carrier containing the semiconductor wafers processed in the second processing apparatus according to the managing information.
2. A fabricating method for a fabricating system including at least first and second processing apparatuses each being provided with at least a processing chamber and an interface for loading and unloading semiconductor wafers contained in a carrier, an inter-apparatus transporter being provided with a common stocker, and at least one computer storing managing information of processing and transporting of the semiconductor wafers comprising the steps of:
processing a plurality of the semiconductor wafers contained in first carrier by the first processing apparatus with a predetermined process condition according to the managing information;
processing a plurality of the semiconductor wafers contained in second carrier by said second processing apparatus with a predetermined process condition according to the managing information; and
starting to transport said first carrier containing the semiconductor wafers having been processed and waiting for transportation in the first processing apparatus toward the second processing apparatus by the inter-apparatus transporter prior to unloading of the second carrier containing the semiconductor wafers processed in the second processing apparatus according to the managing information;
wherein either loading to the second processing apparatus or stocking at the stocker the first carrier containing the semiconductor wafers being transported is selected based on the managing information of processing and transporting of the semiconductor wafers.
3. A fabricating method for a fabricating system including at least first and second processing apparatuses each being provided with at least a processing chamber, an interface, first mechanism for transporting semiconductor wafers between the processing chamber and the interface, second mechanism for transporting semiconductor wafers between an inter-apparatus transporter and the interface, and at least one computer storing managing information of processing and transporting of the semiconductor wafers, comprising the steps of:
processing one of the semiconductor wafers in the first processing apparatus according to the managing information; and
processing another one of the semiconductor wafers in the second processing apparatus according to the managing information; and
transporting the one of the semiconductor wafers processed in the first processing apparatus to the second processing apparatus by the inter-apparatus transporter;
wherein the second mechanism starts to transport one of the semiconductor wafers waiting in the interface of the first processing apparatus to the inter-apparatus transporter before the second mechanism of the second processing apparatus completes transporting of the another one of the semiconductor wafers from the interface of the second processing apparatus to the inter-apparatus transporter according to the managing information.
4. A fabricating method for a fabricating system including at least first and second processing apparatuses each being provided with at least a processing chamber, an interface, first mechanism for transporting semiconductor wafers between the processing chamber and the interface, second mechanism for transporting semiconductor wafers between an inter-apparatus transporter and the interface, and at least one computer storing managing information of processing and transporting of the semiconductor wafers, comprising the steps of:
processing one of the semiconductor wafers in the first processing apparatus according to the managing information; and
processing another one of the semiconductor wafers in the second processing apparatus according to the managing information; and
transporting the one of the semiconductor wafers processed in the first processing apparatus to the second processing apparatus by the inter-apparatus transporter;
wherein the second mechanism starts to transport one of the semiconductor wafers waiting in the interface of the first processing apparatus to the inter-apparatus transporter before the first mechanism of the second processing apparatus completes transporting of the another one of the semiconductor wafers from the processing chamber to the interface of the second processing apparatus according to the managing information.
5. A fabricating method for a fabricating system including at least first and second processing apparatuses each being provided with at least a processing chamber for processing a lot being constituted of plural semiconductor wafers, an interface, first mechanism for transporting the semiconductor wafers between the processing chamber and the interface, second mechanism for transporting the semiconductor wafers between an inter-apparatus transporter and the interface, and at least one computer storing managing information of processing and transporting of the semiconductor wafers, comprising the steps of:
processing one lot of the semiconductor wafers in the first processing apparatus according to the managing information; and
processing another lot of the semiconductor wafers in the second processing apparatus according to the managing information; and
transporting the one lot of the semiconductor wafers processed in the first processing apparatus toward the second processing apparatus by the inter-apparatus transporter;
wherein the second mechanism starts to transport one lot of the semiconductor wafers waiting in the interface of the first processing apparatus toward the inter-apparatus transporter before the second mechanism of the second processing apparatus completes transporting of the another lot of the semiconductor wafers from the interface of the second processing apparatus to the inter-apparatus transporter according to the managing information.
6. A fabricating method for a fabricating system including at least first and second processing apparatuses each being provided with at least a processing chamber for processing a lot being constituted of plurality of semiconductor wafers, an interface, first mechanism for transporting the semiconductor wafers between the processing chamber and the interface, second mechanism for transporting the semiconductor wafers between an inter-apparatus transporter and the interface, and at least one computer storing managing information of processing and transporting of the semiconductor wafers, comprising the steps of:
processing one lot of the semiconductor wafers in the first processing apparatus according to the managing information; and
processing another lot of the semiconductor wafers in the second processing apparatus according to the managing information; and
transporting the one lot of the semiconductor wafers processed in the first processing apparatus toward the second processing apparatus by the inter-apparatus transporter;
wherein the second mechanism starts to transport one lot of the semiconductor wafers waiting in the interface of the first processing apparatus toward the inter-apparatus transporter before the first mechanism of the second processing apparatus completes transporting of the another lot of the semiconductor wafers from the processing chamber to the interface of the second processing apparatus according to the managing information.