MOS transistor having double gate and manufacturing method thereof
There are provided a MOS transistor having a double gate and a manufacturing method thereof. The MOS transistor includes a substrate on which an insulating layer is formed, a first gate embedded in the insulating layer, in which the top surface of the first gate is exposed, a first gate oxide layer formed on the insulating layer and the first gate, a silicon layer formed on the first gate oxide layer, a source region and a drain region formed in the silicon layer to be in contact with the first gate oxide layer, a second gate oxide layer formed on the silicon layer to be in contact with the source and drain regions, and a second gate formed on the second gate oxide layer disposed between the source region and the drain region.
1 . A MOS transistor having a double gate, comprising:
a substrate on which an insulating layer is formed;
a first gate embedded in the insulating layer, wherein the top surface of the first gate is exposed;
a first gate oxide layer formed on the insulating layer and the first gate;
a silicon layer formed on the first gate oxide layer;
a source region and a drain region formed in the silicon layer to be in contact with the first gate oxide layer;
a second gate oxide layer formed on the silicon layer to be in contact with the source and drain regions; and
a second gate formed on the second gate oxide layer disposed between the source region and the drain region.
2 . The MOS transistor according to claim 1 , wherein the insulating layer includes:
a first insulating layer formed on the substrate; and
a second insulating layer formed on the first insulating layer,
wherein the first gate is embedded in the second insulating layer and is formed on the first insulating layer.
3 . The MOS transistor according to claim 1 , wherein the insulating layer is a single insulating layer formed on the substrate, wherein the bottom surface of the first gate is not in contact with the top surface of the substrate.
4 . The MOS transistor according to claim 1 , wherein the top surface of the first gate is equal in height to the top surface of the insulating layer.
5 . The MOS transistor according to claim 1 , wherein the top surface of the first gate is higher than the top surface of the insulating layer.
6 . The MOS transistor according to claim 1 , wherein the top surface of the first gate is lower than the top surface of the insulating layer.
7 . A MOS transistor having a double gate, comprising:
an insulating substrate;
a first gate embedded in the insulating substrate, wherein the top surface of the first gate is exposed;
a first gate oxide layer formed on the insulating substrate and the first gate;
a silicon layer formed on the first gate oxide layer;
a source region and a drain region formed in the silicon layer to be in contact with the first gate oxide layer;
a second gate oxide layer formed on the silicon layer to be in contact with the source and drain regions; and
a second gate formed on the second gate oxide layer disposed between the source region and the drain region.
8 . The MOS transistor according to claim 7 , wherein the insulating layer includes:
a first insulating layer formed on the insulating substrate; and
a second insulating layer formed on the first insulating layer,
wherein the first gate is embedded in the second insulating layer and is formed on the first insulating layer.
9 . The MOS transistor according to claim 7 , wherein the insulating substrate is a single insulating layer, wherein the first gate is not exposed to a lower portion of the insulating substrate.
10 . A method for manufacturing a MOS transistor having a double gate, the method comprising:
preparing a substrate;
forming an insulting layer on the substrate, and forming a first gate in the insulating layer, wherein the top surface of the first gate is exposed;
forming a first gate oxide layer on the insulating layer and the first gate;
forming a silicon layer on the first gate oxide layer;
forming a source region and a drain region in the silicon layer on both sides of the first gate such that the source and drain regions are in contact with the first gate oxide layer;
forming a second gate oxide layer on the silicon layer to be in contact with the source and drain regions; and
forming a second gate on the second gate oxide layer disposed between the source region and the drain region.
11 . The method according to claim 10 , wherein the forming of the first gate comprises:
forming an insulting layer on the substrate;
etching the insulating layer by a predetermined width till the top surface of the substrate is not exposed; and
forming the first gate by depositing polysilicon on the etched insulating layer.
12 . The method according to claim 10 , wherein the forming of the first gate comprises:
forming a first insulating layer on the substrate by thermal oxidation;
forming a first gate on the first insulting layer by depositing and etching polysilicon; and
forming a second insulating layer to embed the first gate of which the top surface is exposed.
13 . The method according to claim 10 , wherein the forming of the first gate comprises:
forming a first insulating layer by implanting ions into a predetermined depth of the substrate and performing a heat treatment;
forming the first gate by performing a patterning and etching process on the substrate over the first insulating layer; and
forming a second insulating layer to embed the first gate of which the top surface is exposed,
wherein the substrate is a polysilicon substrate.
14 . The method according to claim 10 , further comprising, after the forming of the first gate, planarizing the top surface of the insulating layer and the exposed first gate.
15 . A method for manufacturing a MOS transistor having a double gate, the method comprising:
preparing a substrate, wherein a first gate is embedded in an upper portion of the substrate;
forming a silicon layer on which a first gate oxide layer is formed;
bonding the top surface of the substrate and the top surface of the silicon substrate together;
forming a source region and a drain region in the silicon layer by implanting impurities such that the source and drain regions are in contact with the first gate oxide layer;
forming a second gate oxide layer on the silicon layer to be in contact with the source and drain regions; and
forming a second gate on the second gate oxide layer disposed between the source region and the drain region.
16 . The method according to claim 15 , wherein the preparing of the substrate comprises:
forming an insulting layer on the substrate;
etching the insulating layer with a predetermined width till the top surface of the substrate is not exposed; and
forming the first gate by depositing polysilicon on the etched insulating layer.
17 . The method according to claim 15 , wherein the preparing of the substrate comprises:
forming a first insulating layer on the substrate by thermal oxidation;
forming a first gate on the first insulting layer by depositing and etching polysilicon; and
forming a second insulating layer to embed the first gate of which the top surface is exposed.
18 . The method according to claim 15 , wherein the forming of the first gate comprises:
forming a first insulating layer by implanting ions into a predetermined depth of the substrate and performing a heat treatment;
forming the first gate by performing a patterning and etching process on the substrate over the first insulating layer; and
forming a second insulating layer to embed the first gate of which the top surface is expose,
wherein the substrate is a polysilicon substrate.
19 . The method according to claim 15 , wherein the bonding of the top surface of the substrate and the top surface of the silicon substrate together, comprises:
provisionally bonding the top surface of the substrate and the top surface of the silicon layer together; and
completely bonding the substrate and the silicon layer by heating them at a predetermined temperature or higher.
20 . The method according to claim 15 , wherein the bonding of the top surface of the substrate and the top surface of the silicon substrate together, comprises:
rinsing the substrate and the silicon layer;
drying the substrate and the silicon layer; and
completely bonding the substrate and the silicon layer by heating the substrate and the silicon layer at a predetermined temperature or higher.