Method for forming LOCOS layer in semiconductor device

1. A method for manufacturing a semiconductor device, the method comprising:

oxidizing a high voltage region of the semiconductor device to form a LOCOS layer on a silicon substrate in the high voltage region; and

etching the LOCOS layer according to a pattern to expose first and second surfaces of the silicon substrate in the high voltage region;

forming a gate electrode on the first surface and the LOCOS layer; and

forming a source in the first surface and a drain in the second surface, thereby forming the semiconductor device having a substantially linear current transfer path from the source to the drain.

2. The method as claimed in claim 1 , wherein the pattern comprises a first photoresist pattern on an active area of a high voltage device.

3. The method as claimed in claim 2 , further comprising forming the first photoresist pattern on the LOCOS layer.

4. The method as claimed in claim 2 , further comprising forming the photoresist pattern by coating the active area of the LOCOS layer with photoresist and developing the photoresist according to an exposure step using a mask.

5. The method as claimed in claim 4 , further comprising:

removing the photoresist pattern.

6. The method as claimed in claim 1 , wherein the semiconductor device comprises a double-diffused MOS (DMOS) transistor, wherein the transistor comprises the linear current transfer path.

7. The method as claimed in claim 1 , wherein the semiconductor device comprises a lateral DMOS transistor, wherein the transistor comprises the linear current transfer path.

8. The method as claimed in claim 1 , further comprising forming a silicon oxide layer on the silicon substrate, the silicon substrate having p-type impurities therein, prior to oxidizing the high voltage region and forming the semiconductor device thereon.

9. The method as claimed in claim 8 , further comprising forming a silicon nitride layer on the silicon oxide layer, and the silicon nitride layer functions as an oxidation mask.

10. The method as claimed in claim 1 , further comprising forming a deep well in the high voltage region.

11. The method as claimed in claim 1 , further comprising forming a well in a CMOS device region.

12. The method as claimed in claim 1 , wherein the etched LOCOS layer has a slope of from about 60° to about 85°.

13. The method as claimed in claim 11 , further comprising annealing the semiconductor device.

14. The method as claimed in claim 9 , further comprising forming a second photoresist pattern on the silicon nitride layer after the annealing step, and etching the silicon nitride layer using the second photoresist pattern as a mask.

15. The method as claimed in claim 8 , further comprising forming a third photoresist pattern on the silicon oxide layer, and implanting first impurities in a first region of the silicon substrate to form a drift region according to the third photoresist pattern.