Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate
A material for use as part of an internal capacitor within a circuitized substrate includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ferroelectric ceramic component, the ferroelectric ceramic component nano-particles having a particle size substantially in the range of between about 0.01 microns and about 0.9 microns and a surface within the range of from about 2.0 to about 20 square meters per gram. A circuitized substrate adapted for using such a material and capacitor therein and a method of making such a substrate are also provided. An electrical, assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) are also provided.
1 . A material for integral inclusion within a circuitized substrate to function as part of a capacitor within said circuitized substrate, said material comprising:
a polymer resin; and
a quantity of nano-powders including a mixture of at least one metal component and at least one ferroelectric ceramic component, said nano-powders of said ferroelectric ceramic component having a particle size substantially within the range of from about 0.01 microns to about 0.900 microns and a surface area within the range of from about 2.0 to about 20 square meters per gram.
2 . The material of claim 1 wherein said nano-powders comprise from about ten percent to about ninety percent by weight of said material.
3 . The material of claim 1 wherein said at least one ferroelectric ceramic component comprises barium titanate.
4 . The invention of claim 1 wherein said material has a planar capacitance of at least one nanofarad per square inch.
5 . The material of claim 1 wherein said polymer resin comprises an epoxy resin.
6 . The material of claim 5 wherein said epoxy resin comprises a cycloaliphatic epoxy resin.
7 . The material of claim 1 wherein said polymer resin is a phenoxy based resin.
8 . The material of claim 7 wherein said phenoxy based resin has a glass transition temperature of at least about 120 degrees Celsius.
9 . The material of claim 1 further including first and second electrically conductive layers, said material disposed between said first and second electrically conductive layers and in contact therewith, thereby forming a capacitor.
10 . The material of claim 1 wherein the specific gravity of said ferroelectric ceramic particles of said nano-powder is within the range of from about 5.0 to about 6.0.
11 . The material of claim 1 wherein said metal of said metal component is selected from the group consisting of silver, gold, platinum, copper, nickel, palladium, aluminum and combinations or alloys thereof.
12 . A method of making a circuitized substrate having a capacitor included therein, said method comprising:
providing a first dielectric layer;
forming a first electrical conductor on said first layer;
positioning a quantity of material on said first electrical conductor, said quantify of material including a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ferroelectric ceramic component, said nano-powders of said ferroelectric ceramic component having a particle size substantially within the range of from about 0.01 microns to about 0.9 microns and a surface area within the range of from about 2.0 to about 20 square meters per gram;
positioning a second electrical conductor substantially on said quantity of material on said first electrical conductor; and
providing a second dielectric layer, said second dielectric layer located adjacent said first dielectric layer and substantially over said second electrical conductor, said first electrical conductor, said quantity of material and said second electrical conductor being a capacitor.
13 . The method of claim 12 wherein said first electrical conductor is formed using photolithography processing.
14 . The method of claim 12 wherein said positioning of said quantity of material on said first electrical conductor is accomplished using screen printing.
15 . The method of claim 14 wherein said quantity of material is substantially cured prior to said positioning of said second electrical conductor.
16 . The method of claim 12 wherein said positioning of said quantity of material on said first electrical conductor is accomplished using stencil printing.
17 . The method of claim 12 further including depositing a quantity of dielectric material on said first dielectric layer substantially around said first electrical conductor prior to said positioning of said quantity of said material on said first electrical conductor.
18 . The method of claim 12 wherein said positioning of said second electrical conductor substantially on said quantity of material on said first electrical conductor comprises forming said second electrical conductor using a sputtering operation.
19 . The method of claim 12 further including providing electrical circuitry on and/or within said circuitized substrate in electrical connection with said first and/or second electrical conductors.
20 . The method of claim 19 further including electrically coupling at least one conductive thru-hole directly to said first and/or second electrical conductor.