Method and apparatus for inspecting foreign particle defects
View Patent ↗The invention relates to a device production process for forming a circuit pattern on a substrate such as semiconductor device. To enable a stable inspection of a minute foreign particle and a pattern defect occurring in manufacture of a device at a high speed and with a high sensitivity, an object to be inspected on which a transparent film is formed, is irradiated with a beam which is emitted from an illuminator whose illumination direction and illumination angle are selected from a plurality of choices to be optimum, so that scattered reflected light from a minute foreign particle defect on the object or the transparent film is effectively detected by eliminating a noise from the pattern formed on the object, and a detection optical system is optimized by evaluating and adjusting, with an image forming performance checker, an image forming performance of the detection optical system included in an inspecting apparatus.
1. An apparatus for inspecting a foreign particle defect, comprising:
an illuminator which irradiates a surface of a sample with an illuminating beam;
a detector which collects through an objective lens scattered reflected light from the surface of the sample as illuminated by the illuminator and detects the collected light with a detecting device; and
a signal processor which processes a signal obtained as a result of the detection of the scattered reflected light by the detecting device of the detector so as to detect a foreign particle defect on the surface of the sample,
wherein the detector includes a converging optical system which collects the scattered reflected light from the surface of the sample, and an aberration corrector which corrects an aberration of the converging optical system,
wherein the illuminating beam emitted from the illuminator toward the surface of the sample is formed in a shape long in a direction, and emitted from a direction oblique to the surface of the sample, and
wherein the converging optical system of the detector includes a reflection optical system and a refraction optical system, and the aberration corrector corrects the aberration of the converging optical system by changing a reflection condition of the reflection optical system or a refraction condition of the refraction optical system.
2. The apparatus according to claim 1 , wherein the illuminator has a first illuminating portion which irradiates the surface of the sample with an illuminating beam from a high angle, and a second illuminating portion which irradiates the surface of the sample with an illuminating beam from a low angle.
3. An for inspecting a foreign particle defect, comprising:
an illuminator which irradiates a surface of a sample with an illuminating beam;
a detector which collects through an objective lens scattered reflected light from the surface of the sample as illuminated by the illuminator and detects the collected light with a detecting device; and
a signal processor which processes a signal obtained as a result of the detection of the scattered reflected light by the detecting device of the detector so as to detect a foreign particle defect on the surface of the sample,
wherein the detector includes a converging optical system which collects the scattered reflected light from the surface of the sample, and an aberration corrector which corrects an aberration of the converging optical system,
wherein the illuminating beam emitted from the illuminator toward the surface of the sample is formed in a shape long in a direction, and emitted from a direction oblique to the surface of the sample, and
wherein the converging optical system of the detector further includes an image forming magnification changer which changes an image forming magnification of the converging optical system while a position of the objective lens relatively to the detecting device is fixed.
4. The apparatus according to claim 3 , wherein the detecting device of the detector is a time delay integration sensor which outputs detection signals in parallel, and the signal processor processes in parallel the signals as outputted in parallel from the time delay integration sensor.
5. A method for inspecting a foreign particle defect, comprising the steps of:
irradiating a surface of a sample with an illuminating beam;
collecting, with a converging optical system, scattered reflected light from the irradiated sample, and detecting at a desired magnification an image of the scattered reflected light as collected; and
processing a signal obtained as a result of the detection of the scattered reflected light, and detecting a foreign particle defect on the surface of the sample,
wherein the image of the scattered reflected light from the surface of the sample is detected by correcting an aberration of the converging optical system according to the desired magnification,
wherein the irradiating step comprises forming the illuminating beam in a shape long in a direction, and emitting the illuminating beam from a direction oblique to the surface of the sample, and
wherein the irradiating step comprises irradiating the surface of the sample with an angle from which the illuminating beam is emitted being switched between a high angle and a low angle.
6. The method according to claim 5 , wherein the irradiating step comprises irradiating the surface of the sample with an angle from which the illuminating beam is emitted being switched between a high angle and a low angle.
7. The method according to claim 5 , wherein the detecting step comprises detecting the image of the scattered reflected light with a time delay integration sensor of parallel output type, and the processing step comprises in parallel processing signals outputted from the time delay integration sensor in parallel.