Methods and apparatuses for improved positioning in a probing system
View Patent ↗An improved method and apparatus for automatically and accurately aligning a wafer prober to the bonding pads of a semiconductor device are provided. In one embodiment of one aspect of the invention, a multi-loop feedback control system incorporating information from a number of sensors is used to maintain the desired contact position in the presence of disturbances. Other aspects and other embodiments are also described.
1. A testing system operable to maintain a relative position between a plurality of contact electrodes and a plurality of electrical contacts, the testing system comprising:
a first sensor coupled to a first component, the first component configured to hold a device coupled to the plurality of electrical contacts, wherein the first sensor is configured to measure a first parameter along an axis of a three-dimensional coordinate system;
a second sensor coupled to the first component, the second sensor configured to measure a second parameter along the axis; and
a control system coupled to the first component configured to receive information from the first sensor and from the second sensor and configured to determine actuation forces based on the information and wherein the actuation forces act on the first component to maintain a desired relative position between the contact electrodes and the electrical contacts.
2. The system of claim 1 wherein the first parameter and the second parameter are one of a position and a velocity and a force along the axis.
3. The system of claim 1 wherein the axis is parallel to a contact force vector between the contact electrodes and the electrical contacts.
4. The system of claim 1 wherein the first sensor is capable of measuring changes in the first parameter due to temperature variation and contact forces.
5. The system of claim 1 , wherein the control system comprises a first feedback loop using position information measured by the first sensor and a second feedback loop using velocity information measured by the second sensor.
6. The system of claim 1 , wherein at least one of the first sensor and the second sensor is a linear sensor.
7. The system of claim 1 , wherein the first sensor is coupled to an athermal mount.
8. A method for accurately positioning a plurality of contact electrodes relative to a plurality of electrical contacts, the method comprising:
measuring a first parameter along an axis of a three-dimensional coordinate system using a first sensor coupled to a first component, the first component configured to hold a device having the plurality of electrical contacts;
measuring a second parameter along the axis using a second sensor coupled to the first component; and
determining actuation forces using a control system coupled to the first component, wherein the control system is configured to receive information from the first sensor and from the second sensor and wherein the actuation forces act on the first component to maintain a desired relative position between the contact electrodes and the electrical contacts.
9. The method of claim 8 wherein the first parameter and the second parameter are one of a position and a velocity and a force.
10. The method of claim 8 wherein the axis is parallel to a contact force vector between the contact electrodes and the electrical contacts.
11. The method of claim 8 wherein the first sensor is capable of measuring changes in the first parameter due to temperature variation and contact forces.
12. The method of claim 8 wherein the control system comprises a first feedback loop using position information measured by the first sensor and a second feedback loop using velocity information measured by the second sensor.
13. The method of claim 8 , wherein at least one of the first sensor and the second sensor is a linear sensor.
14. A machine-readable medium providing executable program instructions which when executed by a data processing system cause the system to perform a method for accurately positioning a plurality of contact electrodes relative to a plurality of electrical contacts, the method comprising:
measuring a first parameter along an axis of a three-dimensional coordinate system using a first sensor coupled to a first component, the first component configured to hold a device having the plurality of electrical contacts;
measuring a second parameter along the axis using a second sensor coupled to the first component; and
determining actuation forces using a control system coupled to the first component, wherein the control system is configured to receive information from the first sensor and from the second sensor and wherein the actuation forces act on the first component to maintain a desired relative position between the contact electrodes and the electrical contacts.
15. The medium of claim 14 wherein the first parameter and the second parameter are one of a position and a velocity and a force.
16. The medium of claim 14 wherein the axis is parallel to a contact force vector between the contact electrodes and the electrical contacts.
17. The medium of claim 14 wherein the first sensor is capable of measuring changes in the first parameter due to temperature variation and contact forces.
18. The medium of claim 14 wherein the control system comprises a first feedback loop using position information measured by the first sensor and a second feedback loop using velocity information measured by the second sensor.