Addressable microplasma devices and arrays with buried electrodes in ceramic
View Patent ↗An array of microcavity plasma devices is formed in a ceramic substrate that provides structure for and isolation of an array of microcavities that are defined in the ceramic substrate. The ceramic substrate isolates the microcavities from electrodes disposed within the ceramic substrate. The electrodes are disposed to ignite a discharge in microcavities in the array of microcavities upon application of a time-varying potential between the electrodes. Embodiments of the invention include electrode and microcavity arrangements that permit addressing of individual microcavities or groups of microcavities. The contour of the microcavity wall allows for the electric field within the microcavity to be shaped.
1. A microcavity plasma device, comprising:
a ceramic substrate;
an array of microcavities disposed in said ceramic substrate;
a first electrode buried in said ceramic substrate, said first electrode disposed proximate to a plurality of microcavities in said array of microcavities, said first electrode being isolated from said plurality of microcavities by said ceramic substrate; and
a second electrode buried in said ceramic substrate, said second electrode disposed proximate to at least one of said plurality of microcavities, said second electrode being electrically isolated from said at least one of said plurality of microcavities by said ceramic substrate, said second electrode being disposed to cooperate with said first electrode to ignite a discharge in said at least one of said plurality of microcavities upon application of a time-varying potential between said first electrode and said second electrode.
2. The device of claim 1 , wherein said first electrode and said second electrode are substantially coplanar, parallel and disposed upon opposite sides of said plurality of microcavities.
3. The device of claim 2 , wherein at least one of said first electrode and said second electrode includes electrode segments extending between adjacent microcavities in a column of microcavities in said plurality of microcavities.
4. The device of claim 2 , further comprising a third electrode disposed between adjacent microcavities in a column of microcavities in said plurality of microcavities.
5. The device of claim 2 , wherein each of said plurality of microcavities has a cross-section that varies with the depth of said ceramic substrate.
6. The device of claim 1 , wherein each of said plurality of microcavities has a cross-section that varies with the depth of said ceramic substrate, and said first electrode and said second electrode are disposed parallel to walls of said plurality of microcavities.
7. The device of claim 1 , wherein each of said plurality of microcavities comprises a truncated conical microcavity.
8. The device of claim 1 , wherein said first electrode and said second electrode are each shaped so that a thickness of the ceramic substrate between each of said first and second electrodes and an edge of a nearest one of said plurality of microcavities is constant.
9. The device of claim 1 , wherein said first electrode and said second electrode are disposed in parallel planes.
10. The device of claim 9 , wherein said first electrode and said second electrode are transverse with respect to each other.
11. The device of claim 10 , wherein one of said first electrodes and said second electrodes surrounds said plurality of microcavities and is separate from the edge of each of said plurality of microcavities by a thin ring portion of said ceramic substrate.
12. The device of claim 10 , wherein:
said array of microcavities comprises columns of microcavities;
said first electrode comprises a plurality of address electrodes disposed proximate to columns in said plurality of microcavities; and
said second electrode comprises a plurality of sustain electrodes disposed proximate to said columns of microcavities.
13. The device of claim 12 , wherein:
said plurality of first electrodes terminate in first electrode contacts, said ceramic substrate defining a first connector to said first electrode contacts; and
said plurality of second electrodes terminate in second electrode contacts, said ceramic substrate defining a second connector to said second electrode contacts.
14. The device of claim 12 , wherein:
each of said plurality of first electrodes includes first holes having diameters larger than respective microcavities in said rows of microcavities and said microcavities in said rows of microcavities pass through respective ones of said first holes;
each of said plurality of second electrodes includes second holes having diameters larger than respective microcavities in said columns of microcavities and said microcavities in said columns of microcavities pass through respective ones of said second holes.
15. A microcavity plasma array device, comprising:
a ceramic substrate;
an array of microcavities disposed in said ceramic substrate;
electrodes means buried within said ceramic substrate, isolated from said microcavities, but disposed to ignite a discharge in microcavities in said array of microcavities upon application of a time-varying potential between said electrodes.
16. The device of claim 15 , wherein said electrode means are disposed to address individual microcavities within said array of microcavities.
17. The device of claim 15 , wherein said electrode means comprises groups of sustain electrodes and groups of address electrodes.
18. The device of claim 17 , wherein said electrode means further comprises means for igniting plasma in each microcavity in said array of microcavities.