Partially etched leadframe packages having different top and bottom topologies
A package for a micro-electromechanical (MEMS) device is described. A premolded leadframe base has opposing top and bottom surfaces. Each surface is defined by a topology having at least one electrically conductive portion and at least one electrically non-conductive portion, and the topology of the top surface differs from the topology of the bottom surface.
1 . A package for a micro-electromechanical (MEMS) device comprising:
a premolded leadframe base having opposing top and bottom surfaces, each surface being defined by a topology having at least one electrically conductive portion and at least one electrically non-conductive portion,
wherein the topology of the top surface is substantially different from the topology of the bottom surface.
2 . A package according to claim 1 , wherein at least one electrically conductive portion on the top surface is connected to at least one electrically conductive portion on the bottom surface.
3 . A package according to claim 1 , further comprising:
a device cover coupled to the leadframe base, the cover and the base together defining an interior volume containing one or more MEMS devices.
4 . A package according to claim 3 , wherein the device cover shields devices within the interior volume from electromagnetic interference.
5 . A package according to claim 3 , wherein at least one of the device cover and the leadframe base includes an opening adapted to allow sound to enter the interior volume.
6 . A package according to claim 1 , further comprising:
a MEMS microphone die coupled to the leadframe base.
7 . A package according to claim 6 , further comprising:
an ASIC die coupled to the leadframe base.
8 . A method of developing a package for a micro-electromechanical (MEMS) device, the method comprising:
developing a premolded leadframe base having opposing top and bottom surfaces, each surface being defined by a topology having at least one electrically conductive portion and at least one electrically non-conductive portion,
wherein the topology of the top surface is substantially different from the topology of the bottom surface.
9 . A method according to claim 8 , wherein at least one electrically conductive portion on the top surface is connected to at least one electrically conductive portion on the bottom surface.
10 . A method according to claim 8 , further comprising:
coupling a device cover to the leadframe base such that the cover and the base together define an interior volume containing one or more MEMS devices.
11 . A method according to claim 10 , wherein the device cover shields devices within the interior volume from electromagnetic interference.
12 . A method according to claim 10 , further comprising:
including in at least one of the device cover and the leadframe base an opening adapted to allow sound to enter the interior volume.
13 . A method according to claim 8 , further comprising:
coupling a MEMS microphone die to the leadframe base.
14 . A method according to claim 13 , further comprising:
coupling an ASIC die to the leadframe base.
15 . A package for a micro-electromechanical (MEMS) device comprising:
means for developing a premolded leadframe base having opposing top and bottom surfaces, each surface being defined by a topology having at least one electrically conductive portion and at least one electrically non-conductive portion,
wherein the topology of the top surface is substantially different from the topology of the bottom surface.
16 . A package according to claim 15 , wherein at least one electrically conductive portion on the top surface is connected to at least one electrically conductive portion on the bottom surface.
17 . A package according to claim 15 , further comprising:
means for coupling a device cover to the leadframe base such that the cover and the base together define an interior volume containing one or more MEMS devices.
18 . A package according to claim 17 , wherein the device cover shields devices within the interior volume from electromagnetic interference.
19 . A package according to claim 15 , further comprising:
means for including in at least one of the device cover and the leadframe base an opening adapted to allow sound to enter the interior volume.
20 . A package according to claim 15 , further comprising:
means for coupling a MEMS microphone die to the leadframe base.
21 . A package according to claim 20 , further comprising:
means for coupling an ASIC die to the leadframe base.