IP Library › Assignment 028028/0221
Patent Assignment
Reel/Frame 028028/0221

Assignment of Assignor's Interest

Recorded: 2012-04-11 Pages: 21
Assignor
INTERPLEX QLP, INC.
Executed: 2012-02-28
Assignee
IQLP, LLC
14-34 110TH STREET, COLLEGE POINT, NEW YORK, NEW YORK, 11356
Covered Properties (41)
Lead for integrated circuit package
Application: 10/920,957 →
Publication: US 2005/0012186
Methods for enclosing a thermoplastic package
Application: 10/920,643 →
Publication: US 2005/0016750
Thermoplastic Material
Patent: 8,728,606 →
Application: 12/759,844 →
Publication: US 2010/0203283
RF circuit package
Application: 60/443,470 →
Ultra High-Temperature Plastic Package and Method of Manufacture
Application: 12/855,813 →
Publication: US 2010/0305279
Ultra high temperature plastic package and method of manufacture
Application: 60/577,530 →
Die package for connection to a substrate
Application: 60/240,982 →
High Performance Semiconductor Die Carrier
Application: 08/487,100 →
Semiconductor Die Carrier Having Double-Sided Die Attach Plate
Application: 08/487,103 →
Integrated connector and semiconductor die package
Application: 09/977,285 →
Publication: US 2002/0019174
Led reflective package
Application: 11/983,791 →
Publication: US 2008/0111148
LED reflective package
Application: 60/858,018 →
Microcircuit package having ductile layer
Application: 60/858,020 →
Plastic electronic component package
Application: 12/220,543 →
Publication: US 2008/0305355
Plastic electronic component package
Application: 12/001,792 →
Publication: US 2008/0150064
Image sensor package
Application: 60/874,450 →
Microphone with premolded type package
Application: 60/708,449 →
Partially etched leadframe packages having different top and bottom topologies
Application: 11/338,439 →
Publication: US 2007/0040231
Packaged microphone with electrically coupled lid
Application: 11/366,941 →
Publication: US 2007/0071268
Leadframe with Different Topologies for Mems Package
Application: 11/875,130 →
Publication: US 2008/0150104
Flange for Integrated Circuit Package
Patent: 7,053,299 →
Application: 10/920,660 →
Publication: US 2005/0012118
Thermoplastic Material
Patent: 7,736,573 →
Application: 10/920,857 →
Publication: US 2005/0012080
Package for Integrated Circuit Die
Patent: 6,867,367 →
Application: 10/767,309 →
Publication: US 2004/0184239
Ultra High-Temperature Plastic Package and Method of Manufacture
Patent: 7,803,307 →
Application: 11/146,856 →
Publication: US 2009/0295036
Die Package for Connection to a Substrate
Patent: 7,253,365 →
Application: 10/878,000 →
Publication: US 2004/0232447
Die Package for Connection to a Substrate
Patent: 6,797,882 →
Application: 09/978,772 →
Method of Manufacturing a Semiconductor Chip Carrier
Patent: 5,819,403 →
Application: 08/465,146 →
Low Profile Semiconductor Die Carrier
Patent: 5,824,950 →
Application: 08/482,000 →
Semiconductor Die Carrier Having a Dielectric Epoxy Between Adjacent Leads
Patent: 5,821,457 →
Application: 08/902,032 →
Prefabricated Semiconductor Chip Carrier
Patent: 6,828,511 →
Application: 09/964,542 →
Publication: US 2002/0053455
Prefabricated Semiconductor Chip Carrier
Patent: 6,977,432 →
Application: 10/755,414 →
Publication: US 2004/0140542
Prefabricated Semiconductor Chip Carrier
Patent: 6,339,191 →
Application: 08/208,586 →
Apparatus for and Method of Manufacturing a Semiconductor Die Carrier
Patent: 6,857,173 →
Application: 09/705,710 →
Apparatus for and Method of Manufacturing a Semiconductor Die Carrier
Patent: 6,141,869 →
Application: 09/178,650 →
Integrated Connector and Semiconductor Die Package
Patent: 6,305,987 →
Application: 09/249,300 →
Open-Cavity Semiconductor Die Package
Patent: 6,475,832 →
Application: 09/950,702 →
Publication: US 2002/0008308
Open-Cavity Semiconductor Die Package
Patent: 6,709,891 →
Application: 10/231,347 →
Publication: US 2003/0003626
Open-Cavity Semiconductor Die Package
Patent: 6,307,258 →
Application: 09/218,180 →
Microcircuit Package Having Ductile Layer
Patent: 7,679,185 →
Application: 11/983,813 →
Publication: US 2008/0128908
Plastic Electronic Component Package
Patent: 8,039,945 →
Application: 12/950,528 →
Publication: US 2011/0064881
Hermetic Seal
Patent: 7,135,768 →
Application: 09/946,554 →
Publication: US 2003/0042598
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 22, 1995
From: MOSLEY, JOSEPH M.; PORTUONDO, MARIA M.
To: PANDA PROJECT, THE
Reel/Frame 007658/0039 →
Assignment of Assignor's Interest Sep 22, 1995
From: MOSLEY, JOSEPH M.; PORTUONDO, MARIA M.
To: PANDA PROJECT, THE
Reel/Frame 007658/0036 →
Security Interest Jul 6, 1998
From: PANDA PROJECT, INC., THE
To: HELIX (PEI) INC.
Reel/Frame 009289/0906 →
Assignment of Assignor's Interest Mar 9, 2000
From: PANDA PROJECT, INC., THE
To: SILICON BANDWIDTH, INC.
Reel/Frame 010676/0247 →
Security Interest Aug 10, 2000
From: SILICON BANDWIDTH INC.
To: HELIX (PEI) INC.
Reel/Frame 011049/0301 →
Security Interest Feb 27, 2001
From: SILICON BANDWIDTH, INC.
To: VANTAGEPOINT VENTURE PARTNERS 1996, L.P.
Reel/Frame 011506/0190 →
Security Agreement Apr 2, 2001
From: SILICON BANDWIDTH, INC.
To: THREE-FIVE SYSTEMS, INC.
Reel/Frame 011855/0061 →
Security Agreement Apr 2, 2001
From: SILICON BANDWIDTH, INC.
To: THREE-FIVE SYSTEMS, INC.
Reel/Frame 011854/0506 →
Assignment of Assignor's Interest Mar 27, 2002
From: CRANE, STANFORD W., JR.; JEON, MYOUNG-SOO; OGATA, CHARLEY TAKESHI
To: SILICON BANDWIDTH, INC.
Reel/Frame 012739/0198 →
Assignment of Assignor's Interest Mar 10, 2003
From: ZIMMERMAN, MICHAEL
To: QUANTUM LEAP PACKAGING, LLC
Reel/Frame 013820/0572 →
Assignment of Assignor's Interest Mar 26, 2004
From: ZIMMERMAN, MICHAEL
To: QUANTUM LEAP PACKAGING, INC.
Reel/Frame 015133/0261 →
Release of Security Interest May 10, 2004
From: THREE-FIVE SYSTEMS, INC.
To: SILICON BANDWIDTH, INC.
Reel/Frame 014616/0005 →
Release of Security Agreement May 18, 2004
From: THREE-FIVE SYSTEMS, INC.
To: SILICON BANDWIDTH, INC.
Reel/Frame 014646/0207 →
Assignment of Assignor's Interest Jul 8, 2004
From: ZIMMERMAN, MICHAEL
To: QUANTUM LEAP PACKGING, LLC
Reel/Frame 015537/0750 →
Security Agreement Jul 1, 2005
From: VANTAGEPOINT VENTURE PARTNERS 1996, L.P.
To: SILICON BANDWIDTH, INC.
Reel/Frame 016216/0128 →
Termination and Release of Security Agreement Aug 24, 2005
From: HELIX (PEI), INC.
To: THE PANDA PROJECT, INC., C/O SILICON BANDWIDTH, INC.
Reel/Frame 016438/0664 →
Termination and Release of Security Agreement Aug 24, 2005
From: HELIX (PEI) INC.
To: SILICON BANDWIDTH, INC.
Reel/Frame 016438/0709 →
Assignment of Assignor's Interest Sep 1, 2005
From: SILICON BANDWITH, INC.
To: QUANTUM LEAP PACKAGING, INC.
Reel/Frame 016700/0795 →
Assignment of Assignor's Interest Sep 29, 2005
From: FELTON, LAWRENCE E.; HARNEY, KIERAN P.; MARTIN, JOHN R.
To: ANALOG DEVICES, INC.
Reel/Frame 016599/0240 →
Assignment of Assignor's Interest Oct 27, 2005
From: SILICON BANDWITH, INC.
To: QUANTUN LEAP PACKAGING, INC.
Reel/Frame 017154/0025 →
Corrective Assignment to Correct the State of Incorporation from Massachusetts to Delaware, Previously Recorded at Reel 013820, Frame 0572. Dec 5, 2005
From: ZIMMERMAN, MICHAEL
To: QUANTUM LEAP PACKAGING, LLC
Reel/Frame 017090/0907 →
Assignment of Assignor's Interest Dec 12, 2005
From: QUANTUM LEAP PACKAGING, LLC
To: QUANTUM LEAP PACKAGING, INC.
Reel/Frame 017113/0620 →
Assignment of Assignor's Interest Mar 2, 2006
From: HARNEY, KIERAN; MARTIN, JOHN; FELTON, LAWRENCE
To: ANALOG DEVICES, INC.
Reel/Frame 017642/0308 →
Assignment of Assignor's Interest May 8, 2006
From: HARNEY, KIERAN P.; MARTIN, JOHN R.; FELTON, LAWRENCE E.
To: ANALOG DEVICES, INC.
Reel/Frame 017585/0811 →
Assignment of Assignor's Interest Oct 23, 2007
From: ZIMMERMAN, MICHAEL A
To: QUANTUM LEAP PACKAGING INC
Reel/Frame 020001/0128 →