IP Library › Patent Application 10920643
Patent Application
App. No. 10/920,643

Methods for enclosing a thermoplastic package

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Quick Facts
Patent No.
US None
App. No.
10/920,643
Abstract

A circuit package for housing semiconductor or other integrated circuit devices (“die”) includes a high-copper flange, one or more high-copper leads and a liquid crystal polymer frame molded to the flange and the leads. A lid is welded to the frame after a die is attached to the flange.

Claims (4)

1 . A method for enclosing a circuit package, comprising ultrasonically welding a thermoplastic material lid to a thermoplastic material frame of the circuit package using a welding signal having a frequency between about 50 KHz and about 60 KHz and an amplitude less than about 100 microns.

2 . The method of claim 1 , wherein the amplitude is less than about 60 microns.

3 . A method for enclosing a circuit package, comprising laser welding a thermoplastic material lid to a thermoplastic material frame of the circuit package.

4 . A method for enclosing a circuit package, comprising thermal welding a thermoplastic material lid to a thermoplastic material frame of the circuit package.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 18, 2024
From: IM1, LLC; IM2, LLC; IMH1, LLC; IMH2, LLC; IONIC MATERIALS, INC.; IONIC MATERIALS II, INC.; IM HOLDINGS I, INC.; IM HOLDINGS II, INC.
To: TEXTILES COATED, INCORPORATED
Reel/Frame 068626/0541 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 11, 2012
From: INTERPLEX QLP, INC.
To: IQLP, LLC
Reel/Frame 028028/0221 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2009
From: INTERPLEX ENGINEERED PRODUCTS, INC.
To: INTERPLEX QLP, INC.
Reel/Frame 022960/0406 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 15, 2009
From: QUANTUM LEAP PACKAGING, INC.
To: INTERPLEX ENGINEERED PRODUCTS, INC.
Reel/Frame 022951/0884 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S NAME PREVIOUSLY RECORDED ON REEL 022892 FRAME 0082. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jul 6, 2009
From: QUANTUM LEAP PACKAGING, INC.
To: INTERPLEX ENGINEERED PRODUCTS, INC.
Reel/Frame 022915/0962 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2009
From: QUANTUM LEAP PACKAGING, INC.
To: INTERPLEXED ENGINEERED PRODUCTS, INC.
Reel/Frame 022892/0082 →