Patent Assignment
Reel/Frame 022892/0082
Assignment of Assignor's Interest
Recorded: 2009-06-30
Pages: 15
Assignor
QUANTUM LEAP PACKAGING, INC.
Executed: 2009-06-24
Assignee
INTERPLEXED ENGINEERED PRODUCTS, INC.
231 FERRIS AVENUE, EAST PROVIDENCE, RHODE ISLAND, 02916
Covered Properties
(26)
Methods for enclosing a thermoplastic package
Application:
10/920,643 →
Publication:
US 2005/0016750
Thermoplastic Material
Ultra High-Temperature Plastic Package and Method of Manufacture
Led reflective package
Application:
11/983,791 →
Publication:
US 2008/0111148
Microcircuit Package Having Ductile Layer
Plastic electronic component package
Application:
12/220,543 →
Publication:
US 2008/0305355
Plastic electronic component package
Application:
12/001,792 →
Publication:
US 2008/0150064
Packaged microphone with electrically coupled lid
Application:
11/366,941 →
Publication:
US 2007/0071268
Leadframe with Different Topologies for Mems Package
Application:
11/875,130 →
Publication:
US 2008/0150104
Flange for Integrated Circuit Package
Package for Integrated Circuit Die
Die Package for Connection to a Substrate
Die Package for Connection to a Substrate
Patent:
6,797,882 →
Application:
09/978,772 →
Method of Manufacturing a Semiconductor Chip Carrier
Patent:
5,819,403 →
Application:
08/465,146 →
Low Profile Semiconductor Die Carrier
Patent:
5,824,950 →
Application:
08/482,000 →
Semiconductor Die Carrier Having a Dielectric Epoxy Between Adjacent Leads
Patent:
5,821,457 →
Application:
08/902,032 →
Prefabricated Semiconductor Chip Carrier
Prefabricated Semiconductor Chip Carrier
Prefabricated Semiconductor Chip Carrier
Patent:
6,339,191 →
Application:
08/208,586 →
Apparatus for and Method of Manufacturing a Semiconductor Die Carrier
Patent:
6,857,173 →
Application:
09/705,710 →
Apparatus for and Method of Manufacturing a Semiconductor Die Carrier
Patent:
6,141,869 →
Application:
09/178,650 →
Integrated Connector and Semiconductor Die Package
Patent:
6,305,987 →
Application:
09/249,300 →
Open-Cavity Semiconductor Die Package
Open-Cavity Semiconductor Die Package
Open-Cavity Semiconductor Die Package
Patent:
6,307,258 →
Application:
09/218,180 →
Hermetic Seal
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 11, 1994
From: CRANE, STANFORD W., JR.; PORTUONDO, MARIA M.
To: PANDA PROJECT, THE
Reel/Frame 007001/0065 →
Assignment of Assignor's Interest
Sep 11, 1995
From: MOSLEY, JOSEPH M.; PORTUONDO, MARIA M.; TAYLOR, DREW L.
To: PANDA PROJECT, THE
Reel/Frame 007649/0754 →
Security Interest
Jul 6, 1998
From: PANDA PROJECT, INC., THE
To: HELIX (PEI) INC.
Reel/Frame 009289/0906 →
Assignment of Assignor's Interest
Mar 12, 1999
From: CRANE, STANFORD W. JR.; KRISHNAPURA, LAKSHMINARASIMHA; LARCOMB, DANIEL
To: THE PANDA PROJECT
Reel/Frame 009821/0936 →
Assignment of Assignor's Interest
Mar 9, 2000
From: PANDA PROJECT, INC., THE
To: SILICON BANDWIDTH, INC.
Reel/Frame 010678/0049 →
Assignment of Assignor's Interest
Mar 9, 2000
From: PANDA PROJECT, INC., THE
To: SILICON BANDWIDTH, INC.
Reel/Frame 010676/0247 →
Security Interest
Aug 10, 2000
From: SILICON BANDWIDTH INC.
To: HELIX (PEI) INC.
Reel/Frame 011049/0301 →
Security Interest
Feb 27, 2001
From: SILICON BANDWIDTH, INC.
To: VANTAGEPOINT VENTURE PARTNERS 1996, L.P.
Reel/Frame 011506/0190 →
Security Agreement
Apr 2, 2001
From: SILICON BANDWIDTH, INC.
To: THREE-FIVE SYSTEMS, INC.
Reel/Frame 011854/0506 →
Security Agreement
Apr 2, 2001
From: SILICON BANDWIDTH, INC.
To: THREE-FIVE SYSTEMS, INC.
Reel/Frame 011855/0061 →
Assignment of Assignor's Interest
Mar 27, 2002
From: CRANE, STANFORD W., JR.; JEON, MYOUNG-SOO; OGATA, CHARLEY TAKESHI
To: SILICON BANDWIDTH, INC.
Reel/Frame 012739/0198 →
Assignment of Assignor's Interest
Mar 26, 2004
From: ZIMMERMAN, MICHAEL
To: QUANTUM LEAP PACKAGING, INC.
Reel/Frame 015133/0261 →
Release of Security Interest
May 10, 2004
From: THREE-FIVE SYSTEMS, INC.
To: SILICON BANDWIDTH, INC.
Reel/Frame 014616/0005 →
Release of Security Agreement
May 18, 2004
From: THREE-FIVE SYSTEMS, INC.
To: SILICON BANDWIDTH, INC.
Reel/Frame 014646/0207 →
Security Agreement
Jul 1, 2005
From: VANTAGEPOINT VENTURE PARTNERS 1996, L.P.
To: SILICON BANDWIDTH, INC.
Reel/Frame 016216/0128 →
Termination and Release of Security Agreement
Aug 24, 2005
From: HELIX (PEI) INC.
To: SILICON BANDWIDTH, INC.
Reel/Frame 016438/0709 →
Termination and Release of Security Agreement
Aug 24, 2005
From: HELIX (PEI), INC.
To: THE PANDA PROJECT, INC., C/O SILICON BANDWIDTH, INC.
Reel/Frame 016438/0664 →
Assignment of Assignor's Interest
Sep 1, 2005
From: SILICON BANDWITH, INC.
To: QUANTUM LEAP PACKAGING, INC.
Reel/Frame 016700/0795 →
Assignment of Assignor's Interest
Oct 27, 2005
From: SILICON BANDWITH, INC.
To: QUANTUN LEAP PACKAGING, INC.
Reel/Frame 017154/0025 →
Assignment of Assignor's Interest
Mar 2, 2006
From: HARNEY, KIERAN; MARTIN, JOHN; FELTON, LAWRENCE
To: ANALOG DEVICES, INC.
Reel/Frame 017642/0308 →
Assignment of Assignor's Interest
Jan 16, 2008
From: ZIMMERMAN, MICHAEL A.
To: QUANTUM LEAP PACKAGING INC.
Reel/Frame 020375/0239 →
Assignment of Assignor's Interest
Feb 7, 2008
From: ZIMMERMAN, MICHAEL A.; SMITH, KEITH; SHVERDIN, JACOB
To: QUANTUM LEAP PACKAGING, INC
Reel/Frame 020486/0678 →
Assignment of Assignor's Interest
Feb 7, 2008
From: ZIMMERMAN, MICHAEL A.; HARRIS, JONATHAN
To: QUANTUM LEAP PACKAGING, INC.
Reel/Frame 020486/0488 →
Assignment of Assignor's Interest
Mar 26, 2008
From: HARNEY, KIERAN P.; MARTIN, JOHN R.; FELTON, LAWRENCE E.
To: ANALOG DEVICES, INC.
Reel/Frame 020725/0987 →
Assignment of Assignor's Interest
Mar 26, 2008
From: ZIMMERMAN, MICHAEL A.; SMITH, KEITH
To: QUANTUM LEAP PACKAGING, INC.
Reel/Frame 020725/0332 →