Patent Assignment
Reel/Frame 012739/0198
Assignment of Assignor's Interest
Recorded: 2002-03-27
Pages: 3
Assignors
CRANE, STANFORD W., JR.
Executed: 2002-02-22
JEON, MYOUNG-SOO
Executed: 2002-02-22
OGATA, CHARLEY TAKESHI
Executed: 2002-02-25
Assignee
SILICON BANDWIDTH, INC.
46539 FREMONT BOULEVARD, FREMONT, CALIFORNIA, 94538
Covered Property
(1)
Die Package for Connection to a Substrate
Patent:
6,797,882 →
Application:
09/978,772 →
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 1, 2005
From: SILICON BANDWITH, INC.
To: QUANTUM LEAP PACKAGING, INC.
Reel/Frame 016700/0795 →
Assignment of Assignor's Interest
Oct 27, 2005
From: SILICON BANDWITH, INC.
To: QUANTUN LEAP PACKAGING, INC.
Reel/Frame 017154/0025 →
Assignment of Assignor's Interest
Jun 30, 2009
From: QUANTUM LEAP PACKAGING, INC.
To: INTERPLEXED ENGINEERED PRODUCTS, INC.
Reel/Frame 022892/0082 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded on Reel 022892 Frame 0082. Assignor(S) Hereby Confirms the Assignment.
Jul 6, 2009
From: QUANTUM LEAP PACKAGING, INC.
To: INTERPLEX ENGINEERED PRODUCTS, INC.
Reel/Frame 022915/0962 →
Assignment of Assignor's Interest
Jul 15, 2009
From: QUANTUM LEAP PACKAGING, INC.
To: INTERPLEX ENGINEERED PRODUCTS, INC.
Reel/Frame 022951/0884 →
Assignment of Assignor's Interest
Jul 16, 2009
From: INTERPLEX ENGINEERED PRODUCTS, INC.
To: INTERPLEX QLP, INC.
Reel/Frame 022960/0406 →
Assignment of Assignor's Interest
Apr 11, 2012
From: INTERPLEX QLP, INC.
To: IQLP, LLC
Reel/Frame 028028/0221 →