IP Library › Assignment 016700/0795
Patent Assignment
Reel/Frame 016700/0795

Assignment of Assignor's Interest

Recorded: 2005-09-01 Pages: 5
Assignor
SILICON BANDWITH, INC.
Executed: 2005-08-26
Assignee
QUANTUM LEAP PACKAGING, INC.
200 RESEARCH DRIVE, WILMINGTON, MASSACHUSETTS, 01887
Covered Properties (12)
Prefabricated Semiconductor Chip Carrier
Patent: 6,339,191 →
Application: 08/208,586 →
Method of Manufacturing a Semiconductor Chip Carrier
Patent: 5,819,403 →
Application: 08/465,146 →
Apparatus for and Method of Manufacturing a Semiconductor Die Carrier
Patent: 6,141,869 →
Application: 09/178,650 →
Open-Cavity Semiconductor Die Package
Patent: 6,307,258 →
Application: 09/218,180 →
Integrated Connector and Semiconductor Die Package
Patent: 6,305,987 →
Application: 09/249,300 →
Apparatus for and Method of Manufacturing a Semiconductor Die Carrier
Patent: 6,857,173 →
Application: 09/705,710 →
Open-Cavity Semiconductor Die Package
Patent: 6,475,832 →
Application: 09/950,702 →
Publication: US 2002/0008308
Prefabricated Semiconductor Chip Carrier
Patent: 6,828,511 →
Application: 09/964,542 →
Publication: US 2002/0053455
Die Package for Connection to a Substrate
Patent: 6,797,882 →
Application: 09/978,772 →
Open-Cavity Semiconductor Die Package
Patent: 6,709,891 →
Application: 10/231,347 →
Publication: US 2003/0003626
Prefabricated Semiconductor Chip Carrier
Patent: 6,977,432 →
Application: 10/755,414 →
Publication: US 2004/0140542
Die Package for Connection to a Substrate
Patent: 7,253,365 →
Application: 10/878,000 →
Publication: US 2004/0232447
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 11, 1994
From: CRANE, STANFORD W., JR.; PORTUONDO, MARIA M.
To: PANDA PROJECT, THE
Reel/Frame 007001/0065 →
Security Interest Jul 6, 1998
From: PANDA PROJECT, INC., THE
To: HELIX (PEI) INC.
Reel/Frame 009289/0906 →
Assignment of Assignor's Interest Dec 22, 1998
From: CRANE, JR., STANFORD W.; KRISHNAPURA, LAKSHMINARASIMHA; LI, YUN
To: PANDA PROJECT, THE
Reel/Frame 009675/0472 →
Assignment of Assignor's Interest Mar 12, 1999
From: CRANE, STANFORD W. JR.; KRISHNAPURA, LAKSHMINARASIMHA; LARCOMB, DANIEL
To: THE PANDA PROJECT
Reel/Frame 009821/0936 →
Assignment of Assignor's Interest Jul 2, 1999
From: CRANE, STANFORD W.JR.; KRISHNAPURA, LAKSHMINARASIMHA; DUTTA, ARINDUM
To: PANDA PROJECT, THE
Reel/Frame 010066/0132 →
Assignment of Assignor's Interest Mar 9, 2000
From: PANDA PROJECT, INC., THE
To: SILICON BANDWIDTH, INC.
Reel/Frame 010678/0023 →
Assignment of Assignor's Interest Mar 9, 2000
From: PANDA PROJECT, INC., THE
To: SILICON BANDWIDTH, INC.
Reel/Frame 010678/0049 →
Assignment of Assignor's Interest Mar 9, 2000
From: PANDA PROJECT, INC., THE
To: SILICON BANDWIDTH, INC.
Reel/Frame 010676/0247 →
Security Interest Aug 10, 2000
From: SILICON BANDWIDTH INC.
To: HELIX (PEI) INC.
Reel/Frame 011049/0301 →
Security Interest Feb 27, 2001
From: SILICON BANDWIDTH, INC.
To: VANTAGEPOINT VENTURE PARTNERS 1996, L.P.
Reel/Frame 011506/0190 →
Security Agreement Apr 2, 2001
From: SILICON BANDWIDTH, INC.
To: THREE-FIVE SYSTEMS, INC.
Reel/Frame 011854/0506 →
Security Agreement Apr 2, 2001
From: SILICON BANDWIDTH, INC.
To: THREE-FIVE SYSTEMS, INC.
Reel/Frame 011855/0061 →
Assignment of Assignor's Interest Mar 27, 2002
From: CRANE, STANFORD W., JR.; JEON, MYOUNG-SOO; OGATA, CHARLEY TAKESHI
To: SILICON BANDWIDTH, INC.
Reel/Frame 012739/0198 →
Release of Security Interest May 10, 2004
From: THREE-FIVE SYSTEMS, INC.
To: SILICON BANDWIDTH, INC.
Reel/Frame 014616/0005 →
Release of Security Agreement May 18, 2004
From: THREE-FIVE SYSTEMS, INC.
To: SILICON BANDWIDTH, INC.
Reel/Frame 014646/0207 →
Security Agreement Jul 1, 2005
From: VANTAGEPOINT VENTURE PARTNERS 1996, L.P.
To: SILICON BANDWIDTH, INC.
Reel/Frame 016216/0128 →
Termination and Release of Security Agreement Aug 24, 2005
From: HELIX (PEI) INC.
To: SILICON BANDWIDTH, INC.
Reel/Frame 016438/0709 →
Termination and Release of Security Agreement Aug 24, 2005
From: HELIX (PEI), INC.
To: THE PANDA PROJECT, INC., C/O SILICON BANDWIDTH, INC.
Reel/Frame 016438/0664 →
Assignment of Assignor's Interest Oct 27, 2005
From: SILICON BANDWITH, INC.
To: QUANTUN LEAP PACKAGING, INC.
Reel/Frame 017154/0025 →
Corrective Assignment to Correct the Nature of Conveyance from Security Agreement to Release of Security Interest Previously Recorded on Reel 016216 Frame 0128. Assignor(S) Hereby Confirms the Termination and Release of Patent and Trademark Security Agreement. Apr 13, 2009
From: VANTAGEPOINT VENTURE PARTNERS 1996, L.P.
To: SILICON BANDWIDTH, INC.
Reel/Frame 022529/0616 →
Assignment of Assignor's Interest Jun 30, 2009
From: QUANTUM LEAP PACKAGING, INC.
To: INTERPLEXED ENGINEERED PRODUCTS, INC.
Reel/Frame 022892/0082 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded on Reel 022892 Frame 0082. Assignor(S) Hereby Confirms the Assignment. Jul 6, 2009
From: QUANTUM LEAP PACKAGING, INC.
To: INTERPLEX ENGINEERED PRODUCTS, INC.
Reel/Frame 022915/0962 →
Assignment of Assignor's Interest Jul 15, 2009
From: QUANTUM LEAP PACKAGING, INC.
To: INTERPLEX ENGINEERED PRODUCTS, INC.
Reel/Frame 022951/0884 →
Assignment of Assignor's Interest Jul 16, 2009
From: INTERPLEX ENGINEERED PRODUCTS, INC.
To: INTERPLEX QLP, INC.
Reel/Frame 022960/0406 →
Assignment of Assignor's Interest Apr 11, 2012
From: INTERPLEX QLP, INC.
To: IQLP, LLC
Reel/Frame 028028/0221 →