IP Library › Assignment 022529/0616
Patent Assignment
Reel/Frame 022529/0616

Corrective Assignment to Correct the Nature of Conveyance from Security Agreement to Release of Security Interest Previously Recorded on Reel 016216 Frame 0128. Assignor(S) Hereby Confirms the Termination and Release of Patent and Trademark Security Agreement.

Recorded: 2009-04-13 Pages: 17
Assignor
Assignee
SILICON BANDWIDTH, INC.
2890 ZANKER RD, STE 102, SAN JOSE, CALIFORNIA, 95134
Covered Properties (44)
Apparatus Having Inner Layers Supporting Surface-Mount Components
Patent: 5,543,586 →
Application: 08/208,519 →
Prefabricated Semiconductor Chip Carrier
Patent: 6,339,191 →
Application: 08/208,586 →
Semiconductor Chip Carrier Affording a High-Density External Interface
Patent: 5,541,449 →
Application: 08/208,691 →
Computer with Two Fans and Two Air Circulation Areas
Patent: 5,576,931 →
Application: 08/237,366 →
Electrical Interconnect System Having Insulative Shrouds for Preventing Mismating
Patent: 5,637,019 →
Application: 08/339,705 →
High-Density Electrical Interconnect System
Patent: 5,575,688 →
Application: 08/381,142 →
Method of Manufacturing a Semiconductor Chip Carrier Affording a High- Density External Interface
Patent: 5,696,027 →
Application: 08/463,703 →
Method of Manufacturing an Apparatus Having Inner Layers Supporting Surface-Mount Components
Patent: 5,659,953 →
Application: 08/464,384 →
Method of Manufacturing a Semiconductor Chip Carrier
Patent: 5,819,403 →
Application: 08/465,146 →
High-Density Electrical Interconnect System
Patent: 5,641,309 →
Application: 08/469,763 →
Contact Beam for Electrical Interconnect Component
Patent: 5,791,947 →
Application: 08/476,115 →
Low Profile Semiconductor Die Carrier
Patent: 5,824,950 →
Application: 08/482,000 →
Computer System Having Color-Coded Printed Circuit Boards and Corresponding Slots
Patent: 5,661,631 →
Application: 08/487,104 →
Passive Backplane Capable of Being Configured to a Variable Data Path Width Corresponding to a Data Size of the Pluggable Cpu Board
Patent: 5,822,551 →
Application: 08/662,278 →
Computer System Having a Motorized Door Mechanism
Patent: 5,781,408 →
Application: 08/685,547 →
Computer Having a High Density Connector System
Patent: 5,812,797 →
Application: 08/702,195 →
High-Density Electrical Interconnect System
Patent: 5,967,850 →
Application: 08/744,377 →
Electrical Interconnect System with Wire Receiving Portion
Patent: 5,951,320 →
Application: 08/855,368 →
Semiconductor Die Carrier Having a Dielectric Epoxy Between Adjacent Leads
Patent: 5,821,457 →
Application: 08/902,032 →
Electrical Connector Assembly with a Female Electrical Connector Having Internal Flexible Contact Arm
Patent: 6,247,972 →
Application: 08/911,010 →
Electrical Connector Having Staggered Hold-Down Tabs
Patent: 6,050,850 →
Application: 08/911,283 →
Computer System Having a Modular Architecture
Patent: 6,073,229 →
Application: 08/921,463 →
Semiconductor Chip Carrier Affording a High-Density External Interface
Patent: 5,892,280 →
Application: 08/934,330 →
Multi-Chip Module Having Interconnect Dies
Patent: 6,016,256 →
Application: 08/970,379 →
Decorative Panel for Computer Enclosure
Patent: 5,941,617 →
Application: 08/970,434 →
Interface Optimized Computer System Architecture
Patent: 5,951,665 →
Application: 08/970,502 →
Cooling System for Semiconductor Die Carrier
Patent: 6,031,720 →
Application: 08/970,503 →
Semiconductor Die Package for Mounting in Horizontal and Upright Configurations
Patent: 6,078,102 →
Application: 09/033,480 →
Passive Backplane Capable of Being Configured to a Variable Data Path Width Corresponding to a Data Size of the Pluggable Cpu Board
Patent: 6,092,139 →
Application: 09/083,083 →
Apparatus for and Method of Manufacturing a Semiconductor Die Carrier
Patent: 6,141,869 →
Application: 09/178,650 →
Open-Cavity Semiconductor Die Package
Patent: 6,307,258 →
Application: 09/218,180 →
A Semiconductor Chip Carrier Including an Interconnect Component
Patent: 6,097,086 →
Application: 09/244,435 →
Integrated Connector and Semiconductor Die Package
Patent: 6,305,987 →
Application: 09/249,300 →
Electrical Connector Having Staggered Hold-Down Tabs
Patent: 6,334,794 →
Application: 09/261,256 →
Multi-chip module having interconnect dies
Patent: 6,266,246 →
Application: 09/484,047 →
Modular Architecture for High Bandwidth Computers
Patent: 6,574,726 →
Application: 09/536,628 →
Publication: US 2002/0166040
Semiconductor Chip Carrier Affording a High-Density External Interface
Patent: 6,577,003 →
Application: 09/631,110 →
Computer Cabinet
Patent: 369,923 →
Application: 29/019,780 →
Computer Cabinet
Patent: 363,707 →
Application: 29/019,781 →
Computer Cabinet
Patent: 382,254 →
Application: 29/036,617 →
Computer Cabinet with Extending Speakers
Patent: 377,009 →
Application: 29/046,826 →
Computer Cabinet
Patent: 430,565 →
Application: 29/081,929 →
Computer Cabinet
Patent: 447,143 →
Application: 29/092,575 →
Die package for connection to a substrate
Application: 60/240,982 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 11, 1994
From: CRANE, STANFORD W., JR.; PORTUONDO, MARIA M.
To: PANDA PROJECT, THE
Reel/Frame 007001/0065 →
Assignment of Assignor's Interest May 11, 1994
From: CRANE, STANFORD W., JR.; PORTUONDO, MARIA M.
To: PANDA PROJECT, THE
Reel/Frame 006992/0514 →
Assignment of Assignor's Interest May 11, 1994
From: CRANE, STANFORD W. JR.; PORTUONDO, MARIA M.
To: PANDA PROJECT, THE
Reel/Frame 006989/0288 →
Assignment of Assignor's Interest Oct 3, 1994
From: CRANE, STANFORD W., JR.; PORTUONDO, MARIA; CRUZ, EDWARD V.; RAZO, VINCENT R.
To: PANDA PROJECT, THE
Reel/Frame 007156/0635 →
Assignment of Assignor's Interest Dec 23, 1994
From: CRANE, STANFORD W., JR.; PORTUONDO, MARIA M.
To: PANDA PROJECT, THE
Reel/Frame 007285/0240 →
Assignment of Assignor's Interest Sep 8, 1995
From: CRANE, STANFORD W., JR.; PORTUONDO, MARIA M.
To: PANDA PROJECT, THE
Reel/Frame 007631/0418 →
Assignment of Assignor's Interest Sep 11, 1995
From: MOSLEY, JOSEPH M.; PORTUONDO, MARIA M.; TAYLOR, DREW L.
To: PANDA PROJECT, THE
Reel/Frame 007649/0754 →
Assignment of Assignor's Interest Sep 26, 1995
From: CRANE, STANFORD W., JR.; PORTUONDO, MARIA M.; CONDON, MICHAEL J.; SARUBBI, JOSEPH A.
To: PANDA PROJECT, THE
Reel/Frame 007681/0795 →
Assignment of Assignor's Interest Aug 14, 1997
From: CRANE, JR., STANFORD W.; KRISHNAPURA, LAKSHMINARASIMHA; DUTTA, ARINDUM; LINK, KEVIN
To: PANDA PROJECT, THE
Reel/Frame 008789/0646 →
Assignment of Assignor's Interest Aug 14, 1997
From: CRANE, JR., STANFORD W.; KRISHNAPURA, LAKSHMINARASIMHA; DUTTA, ARINDUM; LINK, KEVIN
To: PANDA PROJECT, THE
Reel/Frame 008751/0650 →
Assignment of Assignor's Interest Feb 23, 1998
From: CRANE, STANFORD W., JR.; KRISHNAPURA, LAKSHMINARASIMHA; DUTTA, ARINDUM; LINK, KEVIN
To: PANDA PROJECT, THE
Reel/Frame 009026/0193 →
Assignment of Assignor's Interest Feb 26, 1998
From: CRANE, STANFORD W., JR.; KRISHNAPURA, LAKSHMINARASIMHA; DUTTA, ARINDUM; LINK, KEVIN
To: PANDA PROJECT, THE
Reel/Frame 009018/0356 →
Assignment of Assignor's Interest Apr 8, 1998
From: CRANE, JR. STANFORD W.; KRISHNAPURA, LAKSHMINARASIMHA; LI, YUN; BEHAR, MOISES
To: PANDA PROJECT, THE
Reel/Frame 009099/0275 →
Assignment of Assignor's Interest Apr 30, 1998
From: CRANE, STANFORD W., JR.; MICHALSKI, DANIEL J.
To: PANDA PROJECT, THE
Reel/Frame 009142/0266 →
Security Interest Jul 6, 1998
From: PANDA PROJECT, INC., THE
To: HELIX (PEI) INC.
Reel/Frame 009289/0906 →
Assignment of Assignor's Interest Feb 3, 1999
From: BEHAR, MOISES
To: PANDA PROJECT, THE
Reel/Frame 009735/0893 →
Assignment of Assignor's Interest Mar 9, 2000
From: PANDA PROJECT, INC., THE
To: SILICON BANDWIDTH, INC.
Reel/Frame 010678/0049 →
Assignment of Assignor's Interest Mar 9, 2000
From: PANDA PROJECT, INC., THE
To: SILICON BANDWIDTH, INC.
Reel/Frame 010676/0247 →
Security Interest Aug 10, 2000
From: SILICON BANDWIDTH INC.
To: HELIX (PEI) INC.
Reel/Frame 011049/0301 →
Security Interest Feb 27, 2001
From: SILICON BANDWIDTH, INC.
To: VANTAGEPOINT VENTURE PARTNERS 1996, L.P.
Reel/Frame 011506/0190 →
Security Agreement Apr 2, 2001
From: SILICON BANDWIDTH, INC.
To: THREE-FIVE SYSTEMS, INC.
Reel/Frame 011855/0061 →
Security Agreement Apr 2, 2001
From: SILICON BANDWIDTH, INC.
To: THREE-FIVE SYSTEMS, INC.
Reel/Frame 011854/0506 →
Release of Security Interest May 10, 2004
From: THREE-FIVE SYSTEMS, INC.
To: SILICON BANDWIDTH, INC.
Reel/Frame 014616/0005 →
Release of Security Agreement May 18, 2004
From: THREE-FIVE SYSTEMS, INC.
To: SILICON BANDWIDTH, INC.
Reel/Frame 014646/0207 →
Security Agreement Jul 1, 2005
From: VANTAGEPOINT VENTURE PARTNERS 1996, L.P.
To: SILICON BANDWIDTH, INC.
Reel/Frame 016216/0128 →