Granted Patent
Utility
US 5,967,850 · App. 08/744,377
High-density electrical interconnect system
Inventor:
Stanford W. Crane, Jr.
Patented Case
View Patent ↗
Granted: Oct 19, 1999
Filed: Nov 7, 1996
Inventor
Stanford W. Crane, Jr.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.