IP Library › Assignment 010676/0247
Patent Assignment
Reel/Frame 010676/0247

Assignment of Assignor's Interest

Recorded: 2000-03-09 Pages: 7
Assignor
PANDA PROJECT, INC., THE
Executed: 2000-02-18
Assignee
SILICON BANDWIDTH, INC.
46539 FREMONT BLVD., FREMONT, CALIFORNIA, 94538
Covered Properties (22)
Apparatus Having Inner Layers Supporting Surface-Mount Components
Patent: 5,543,586 →
Application: 08/208,519 →
Semiconductor Chip Carrier Affording a High-Density External Interface
Patent: 5,541,449 →
Application: 08/208,691 →
Computer with Two Fans and Two Air Circulation Areas
Patent: 5,576,931 →
Application: 08/237,366 →
Electrical Interconnect System Having Insulative Shrouds for Preventing Mismating
Patent: 5,637,019 →
Application: 08/339,705 →
Method of Manufacturing a Semiconductor Chip Carrier Affording a High- Density External Interface
Patent: 5,696,027 →
Application: 08/463,703 →
Method of Manufacturing an Apparatus Having Inner Layers Supporting Surface-Mount Components
Patent: 5,659,953 →
Application: 08/464,384 →
Method of Manufacturing a Semiconductor Chip Carrier
Patent: 5,819,403 →
Application: 08/465,146 →
Contact Beam for Electrical Interconnect Component
Patent: 5,791,947 →
Application: 08/476,115 →
Low Profile Semiconductor Die Carrier
Patent: 5,824,950 →
Application: 08/482,000 →
Computer System Having Color-Coded Printed Circuit Boards and Corresponding Slots
Patent: 5,661,631 →
Application: 08/487,104 →
Passive Backplane Capable of Being Configured to a Variable Data Path Width Corresponding to a Data Size of the Pluggable Cpu Board
Patent: 5,822,551 →
Application: 08/662,278 →
Computer System Having a Motorized Door Mechanism
Patent: 5,781,408 →
Application: 08/685,547 →
Computer Having a High Density Connector System
Patent: 5,812,797 →
Application: 08/702,195 →
Semiconductor Die Carrier Having a Dielectric Epoxy Between Adjacent Leads
Patent: 5,821,457 →
Application: 08/902,032 →
Semiconductor Chip Carrier Affording a High-Density External Interface
Patent: 5,892,280 →
Application: 08/934,330 →
Multi-Chip Module Having Interconnect Dies
Patent: 6,016,256 →
Application: 08/970,379 →
Decorative Panel for Computer Enclosure
Patent: 5,941,617 →
Application: 08/970,434 →
Interface Optimized Computer System Architecture
Patent: 5,951,665 →
Application: 08/970,502 →
Computer Cabinet
Patent: 369,923 →
Application: 29/019,780 →
Computer Cabinet
Patent: 363,707 →
Application: 29/019,781 →
Computer Cabinet
Patent: 382,254 →
Application: 29/036,617 →
Computer Cabinet with Extending Speakers
Patent: 377,009 →
Application: 29/046,826 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 10, 1994
From: CRANE,, STANFORD W., JR.; PORTUONDO, MARIA M.; CRUZ, EDWARD V.; FYNN, SHAUN
To: PANDA PROJECT, THE
Reel/Frame 006981/0467 →
Assignment of Assignor's Interest May 10, 1994
From: CRANE, STANFORD W., JR.; PORTUONDO, MARIA M.; CRUZ, EDWARD V.; FYNN, SHAUN
To: PANDA PROJECT, THE
Reel/Frame 006992/0530 →
Assignment of Assignor's Interest May 11, 1994
From: CRANE, STANFORD W., JR.; PORTUONDO, MARIA M.
To: PANDA PROJECT, THE
Reel/Frame 006992/0514 →
Assignment of Assignor's Interest May 11, 1994
From: CRANE, STANFORD W. JR.; PORTUONDO, MARIA M.
To: PANDA PROJECT, THE
Reel/Frame 006989/0288 →
Assignment of Assignor's Interest Oct 3, 1994
From: CRANE, STANFORD W., JR.; PORTUONDO, MARIA; CRUZ, EDWARD V.; RAZO, VINCENT R.
To: PANDA PROJECT, THE
Reel/Frame 007156/0635 →
Assignment of Assignor's Interest Dec 23, 1994
From: CRANE, STANFORD W., JR.; PORTUONDO, MARIA M.
To: PANDA PROJECT, THE
Reel/Frame 007285/0240 →
Assignment of Assignor's Interest May 18, 1995
From: CRANE, STANFORD W., JR.; PORTUONDO, MARIA M.; FOY, HUNTER T.; ALLAN, JAMES
To: PANDA PROJECT, THE
Reel/Frame 007469/0891 →
Assignment of Assignor's Interest Sep 8, 1995
From: CRANE, STANFORD W., JR.; PORTUONDO, MARIA M.
To: PANDA PROJECT, THE
Reel/Frame 007631/0418 →
Assignment of Assignor's Interest Sep 11, 1995
From: MOSLEY, JOSEPH M.; PORTUONDO, MARIA M.; TAYLOR, DREW L.
To: PANDA PROJECT, THE
Reel/Frame 007649/0754 →
Assignment of Assignor's Interest Sep 26, 1995
From: CRANE, STANFORD W., JR.; PORTUONDO, MARIA M.; CONDON, MICHAEL J.; SARUBBI, JOSEPH A.
To: PANDA PROJECT, THE
Reel/Frame 007681/0795 →
Assignment of Assignor's Interest Jan 18, 1996
From: BURKS, STEPHEN G.
To: PANDA PROJECT, THE
Reel/Frame 007770/0328 →
Assignment of Assignor's Interest Jan 18, 1996
From: CRANE, STANFORD W. JR.; SMITH, BRUCE; LOWN, AARON
To: PANDA PROJECT, THE
Reel/Frame 007768/0856 →
Assignment of Assignor's Interest Jan 18, 1996
From: OTIS, JON PATRICK
To: PANDA PROJECT, THE
Reel/Frame 007768/0883 →
Assignment of Assignor's Interest Jan 18, 1996
From: SCHNEEBELI, RICHARD JAMES, JR.
To: PANDA PROJECT, THE
Reel/Frame 007769/0824 →
Assignment of Assignor's Interest Apr 8, 1998
From: CRANE, JR. STANFORD W.; KRISHNAPURA, LAKSHMINARASIMHA; LI, YUN; BEHAR, MOISES
To: PANDA PROJECT, THE
Reel/Frame 009099/0275 →
Assignment of Assignor's Interest Apr 27, 1998
From: CRANE, STANFORD W., JR.; KRISHNAPURA, LAKSHMINARASIMHA; FUOCO, DANIEL; LEE, ROY K.
To: PANDA PROJECT, THE
Reel/Frame 009193/0051 →
Assignment of Assignor's Interest Apr 30, 1998
From: CRANE, STANFORD W., JR.; MICHALSKI, DANIEL J.
To: PANDA PROJECT, THE
Reel/Frame 009142/0266 →
Security Interest Jul 6, 1998
From: PANDA PROJECT, INC., THE
To: HELIX (PEI) INC.
Reel/Frame 009289/0906 →
Assignment of Assignor's Interest Feb 3, 1999
From: BEHAR, MOISES
To: PANDA PROJECT, THE
Reel/Frame 009735/0893 →
Security Interest Aug 10, 2000
From: SILICON BANDWIDTH INC.
To: HELIX (PEI) INC.
Reel/Frame 011049/0301 →
Security Interest Feb 27, 2001
From: SILICON BANDWIDTH, INC.
To: VANTAGEPOINT VENTURE PARTNERS 1996, L.P.
Reel/Frame 011506/0190 →
Security Agreement Apr 2, 2001
From: SILICON BANDWIDTH, INC.
To: THREE-FIVE SYSTEMS, INC.
Reel/Frame 011855/0061 →
Release of Security Agreement May 18, 2004
From: THREE-FIVE SYSTEMS, INC.
To: SILICON BANDWIDTH, INC.
Reel/Frame 014646/0207 →
Security Agreement Jul 1, 2005
From: VANTAGEPOINT VENTURE PARTNERS 1996, L.P.
To: SILICON BANDWIDTH, INC.
Reel/Frame 016216/0128 →
Termination and Release of Security Agreement Aug 24, 2005
From: HELIX (PEI), INC.
To: THE PANDA PROJECT, INC., C/O SILICON BANDWIDTH, INC.
Reel/Frame 016438/0664 →