IP Library › Assignment 011506/0190
Patent Assignment
Reel/Frame 011506/0190

Security Interest

Recorded: 2001-02-27 Pages: 14
Assignor
SILICON BANDWIDTH, INC.
Executed: 2001-02-09
Assignee
VANTAGEPOINT VENTURE PARTNERS 1996, L.P.
1001 BAYHILL DRIVE, SUITE 100, SAN BRUNO, CALIFORNIA, 94066
Covered Properties (44)
Apparatus Having Inner Layers Supporting Surface-Mount Components
Patent: 5,543,586 →
Application: 08/208,519 →
Prefabricated Semiconductor Chip Carrier
Patent: 6,339,191 →
Application: 08/208,586 →
Semiconductor Chip Carrier Affording a High-Density External Interface
Patent: 5,541,449 →
Application: 08/208,691 →
Computer with Two Fans and Two Air Circulation Areas
Patent: 5,576,931 →
Application: 08/237,366 →
Electrical Interconnect System Having Insulative Shrouds for Preventing Mismating
Patent: 5,637,019 →
Application: 08/339,705 →
High-Density Electrical Interconnect System
Patent: 5,575,688 →
Application: 08/381,142 →
Method of Manufacturing a Semiconductor Chip Carrier Affording a High- Density External Interface
Patent: 5,696,027 →
Application: 08/463,703 →
Method of Manufacturing an Apparatus Having Inner Layers Supporting Surface-Mount Components
Patent: 5,659,953 →
Application: 08/464,384 →
Method of Manufacturing a Semiconductor Chip Carrier
Patent: 5,819,403 →
Application: 08/465,146 →
High-Density Electrical Interconnect System
Patent: 5,641,309 →
Application: 08/469,763 →
Contact Beam for Electrical Interconnect Component
Patent: 5,791,947 →
Application: 08/476,115 →
Low Profile Semiconductor Die Carrier
Patent: 5,824,950 →
Application: 08/482,000 →
Computer System Having Color-Coded Printed Circuit Boards and Corresponding Slots
Patent: 5,661,631 →
Application: 08/487,104 →
Passive Backplane Capable of Being Configured to a Variable Data Path Width Corresponding to a Data Size of the Pluggable Cpu Board
Patent: 5,822,551 →
Application: 08/662,278 →
Computer System Having a Motorized Door Mechanism
Patent: 5,781,408 →
Application: 08/685,547 →
Computer Having a High Density Connector System
Patent: 5,812,797 →
Application: 08/702,195 →
High-Density Electrical Interconnect System
Patent: 5,967,850 →
Application: 08/744,377 →
Electrical Interconnect System with Wire Receiving Portion
Patent: 5,951,320 →
Application: 08/855,368 →
Semiconductor Die Carrier Having a Dielectric Epoxy Between Adjacent Leads
Patent: 5,821,457 →
Application: 08/902,032 →
Electrical Connector Assembly with a Female Electrical Connector Having Internal Flexible Contact Arm
Patent: 6,247,972 →
Application: 08/911,010 →
Electrical Connector Having Staggered Hold-Down Tabs
Patent: 6,050,850 →
Application: 08/911,283 →
Computer System Having a Modular Architecture
Patent: 6,073,229 →
Application: 08/921,463 →
Semiconductor Chip Carrier Affording a High-Density External Interface
Patent: 5,892,280 →
Application: 08/934,330 →
Multi-Chip Module Having Interconnect Dies
Patent: 6,016,256 →
Application: 08/970,379 →
Decorative Panel for Computer Enclosure
Patent: 5,941,617 →
Application: 08/970,434 →
Interface Optimized Computer System Architecture
Patent: 5,951,665 →
Application: 08/970,502 →
Cooling System for Semiconductor Die Carrier
Patent: 6,031,720 →
Application: 08/970,503 →
Semiconductor Die Package for Mounting in Horizontal and Upright Configurations
Patent: 6,078,102 →
Application: 09/033,480 →
Passive Backplane Capable of Being Configured to a Variable Data Path Width Corresponding to a Data Size of the Pluggable Cpu Board
Patent: 6,092,139 →
Application: 09/083,083 →
Apparatus for and Method of Manufacturing a Semiconductor Die Carrier
Patent: 6,141,869 →
Application: 09/178,650 →
Open-Cavity Semiconductor Die Package
Patent: 6,307,258 →
Application: 09/218,180 →
A Semiconductor Chip Carrier Including an Interconnect Component
Patent: 6,097,086 →
Application: 09/244,435 →
Integrated Connector and Semiconductor Die Package
Patent: 6,305,987 →
Application: 09/249,300 →
Electrical Connector Having Staggered Hold-Down Tabs
Patent: 6,334,794 →
Application: 09/261,256 →
Multi-chip module having interconnect dies
Patent: 6,266,246 →
Application: 09/484,047 →
Modular Architecture for High Bandwidth Computers
Patent: 6,574,726 →
Application: 09/536,628 →
Publication: US 2002/0166040
Semiconductor Chip Carrier Affording a High-Density External Interface
Patent: 6,577,003 →
Application: 09/631,110 →
Computer Cabinet
Patent: 369,923 →
Application: 29/019,780 →
Computer Cabinet
Patent: 363,707 →
Application: 29/019,781 →
Computer Cabinet
Patent: 382,254 →
Application: 29/036,617 →
Computer Cabinet with Extending Speakers
Patent: 377,009 →
Application: 29/046,826 →
Computer Cabinet
Patent: 430,565 →
Application: 29/081,929 →
Computer Cabinet
Patent: 447,143 →
Application: 29/092,575 →
Die package for connection to a substrate
Application: 60/240,982 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 11, 1994
From: CRANE, STANFORD W. JR.; PORTUONDO, MARIA M.
To: PANDA PROJECT, THE
Reel/Frame 006989/0288 →
Assignment of Assignor's Interest May 11, 1994
From: CRANE, STANFORD W., JR.; PORTUONDO, MARIA M.
To: PANDA PROJECT, THE
Reel/Frame 007001/0065 →
Assignment of Assignor's Interest May 11, 1994
From: CRANE, STANFORD W., JR.; PORTUONDO, MARIA M.
To: PANDA PROJECT, THE
Reel/Frame 006992/0514 →
Assignment of Assignor's Interest Oct 3, 1994
From: CRANE, STANFORD W., JR.; PORTUONDO, MARIA; CRUZ, EDWARD V.; RAZO, VINCENT R.
To: PANDA PROJECT, THE
Reel/Frame 007156/0635 →
Assignment of Assignor's Interest Dec 23, 1994
From: CRANE, STANFORD W., JR.; PORTUONDO, MARIA M.
To: PANDA PROJECT, THE
Reel/Frame 007285/0240 →
Assignment of Assignor's Interest Sep 8, 1995
From: CRANE, STANFORD W., JR.; PORTUONDO, MARIA M.
To: PANDA PROJECT, THE
Reel/Frame 007631/0418 →
Assignment of Assignor's Interest Sep 11, 1995
From: MOSLEY, JOSEPH M.; PORTUONDO, MARIA M.; TAYLOR, DREW L.
To: PANDA PROJECT, THE
Reel/Frame 007649/0754 →
Assignment of Assignor's Interest Sep 26, 1995
From: CRANE, STANFORD W., JR.; PORTUONDO, MARIA M.; CONDON, MICHAEL J.; SARUBBI, JOSEPH A.
To: PANDA PROJECT, THE
Reel/Frame 007681/0795 →
Assignment of Assignor's Interest Aug 14, 1997
From: CRANE, JR., STANFORD W.; KRISHNAPURA, LAKSHMINARASIMHA; DUTTA, ARINDUM; LINK, KEVIN
To: PANDA PROJECT, THE
Reel/Frame 008789/0646 →
Assignment of Assignor's Interest Aug 14, 1997
From: CRANE, JR., STANFORD W.; KRISHNAPURA, LAKSHMINARASIMHA; DUTTA, ARINDUM; LINK, KEVIN
To: PANDA PROJECT, THE
Reel/Frame 008751/0650 →
Assignment of Assignor's Interest Feb 23, 1998
From: CRANE, STANFORD W., JR.; KRISHNAPURA, LAKSHMINARASIMHA; DUTTA, ARINDUM; LINK, KEVIN
To: PANDA PROJECT, THE
Reel/Frame 009026/0193 →
Assignment of Assignor's Interest Feb 26, 1998
From: CRANE, STANFORD W., JR.; KRISHNAPURA, LAKSHMINARASIMHA; DUTTA, ARINDUM; LINK, KEVIN
To: PANDA PROJECT, THE
Reel/Frame 009018/0356 →
Assignment of Assignor's Interest Apr 8, 1998
From: CRANE, JR. STANFORD W.; KRISHNAPURA, LAKSHMINARASIMHA; LI, YUN; BEHAR, MOISES
To: PANDA PROJECT, THE
Reel/Frame 009099/0275 →
Assignment of Assignor's Interest Apr 30, 1998
From: CRANE, STANFORD W., JR.; MICHALSKI, DANIEL J.
To: PANDA PROJECT, THE
Reel/Frame 009142/0266 →
Security Interest Jul 6, 1998
From: PANDA PROJECT, INC., THE
To: HELIX (PEI) INC.
Reel/Frame 009289/0906 →
Assignment of Assignor's Interest Feb 3, 1999
From: BEHAR, MOISES
To: PANDA PROJECT, THE
Reel/Frame 009735/0893 →
Assignment of Assignor's Interest Mar 9, 2000
From: PANDA PROJECT, INC., THE
To: SILICON BANDWIDTH, INC.
Reel/Frame 010676/0247 →
Assignment of Assignor's Interest Mar 9, 2000
From: PANDA PROJECT, INC., THE
To: SILICON BANDWIDTH, INC.
Reel/Frame 010678/0049 →
Security Interest Aug 10, 2000
From: SILICON BANDWIDTH INC.
To: HELIX (PEI) INC.
Reel/Frame 011049/0301 →
Security Agreement Apr 2, 2001
From: SILICON BANDWIDTH, INC.
To: THREE-FIVE SYSTEMS, INC.
Reel/Frame 011855/0061 →
Security Agreement Apr 2, 2001
From: SILICON BANDWIDTH, INC.
To: THREE-FIVE SYSTEMS, INC.
Reel/Frame 011854/0506 →
Release of Security Interest May 10, 2004
From: THREE-FIVE SYSTEMS, INC.
To: SILICON BANDWIDTH, INC.
Reel/Frame 014616/0005 →
Release of Security Agreement May 18, 2004
From: THREE-FIVE SYSTEMS, INC.
To: SILICON BANDWIDTH, INC.
Reel/Frame 014646/0207 →
Security Agreement Jul 1, 2005
From: VANTAGEPOINT VENTURE PARTNERS 1996, L.P.
To: SILICON BANDWIDTH, INC.
Reel/Frame 016216/0128 →
Termination and Release of Security Agreement Aug 24, 2005
From: HELIX (PEI), INC.
To: THE PANDA PROJECT, INC., C/O SILICON BANDWIDTH, INC.
Reel/Frame 016438/0664 →