Prefabricated semiconductor chip carrier
A semiconductor die carrier includes a plurality of electrically insulative side walls; a plurality of electrically conductive leads extending from at least one of the side walls, each of the leads being individually manufactured without use of a lead frame; a semiconductor die positioned such that the electrically conductive leads are disposed at one or more locations around the periphery of the die; and structure for providing electrical connection between the semiconductor die and corresponding ones of the electrically conductive leads. A method of manufacturing a semiconductor die carrier includes the steps of individually manufacturing a plurality of electrically conductive leads without use of a lead frame; extending a plurality of the electrically conductive leads from at least one of a plurality of electrically insulative side walls; positioning a semiconductor die such that the electrically conductive leads are disposed at one or more locations around the periphery of the die; and electrically connecting the semiconductor die to corresponding ones of the electrically conductive leads.
1. A semiconductor die carrier comprising:
a carrier housing including a plurality of electrically insulative side walls;
a plurality of substantially L-shaped electrically conductive leads extending through at least one of the side walls and arranged in multiple vertically-spaced rows, the leads secured in said at least one side wall by friction, wherein each of the leads includes a mounting surface external of the carrier housing for forming a surface mount electrical connection to a circuit board;
a semiconductor die positioned within said carrier housing such that the electrically conductive leads are disposed at one or more locations around the periphery of the die, said semiconductor die comprising a plurality of bonding pads; and
electrically-conductive bond wiring extending between the bonding pads and the leads for providing electrical connection between the semiconductor die and corresponding ones of the electrically conductive leads.
2. The semiconductor die carrier according to claim 1 , wherein the leads comprise a first group of leads and a second group of leads, the mounting surfaces of the first group of leads are positioned for contacting a first level of the circuit board and the mounting surfaces of the second group of leads are positioned for contacting a second level of the circuit board.
3. The semiconductor die carrier according to claim 1 , further comprising a second semiconductor die positioned within said carrier housing.
4. The semiconductor die carrier according to claim 1 , wherein said carrier housing further comprises a thermally conductive cap.
5. The semiconductor die carrier according to claim 1 , wherein the leads extend from multiple side walls of the carrier housing.
6. The semiconductor die carrier according to claim 1 , wherein the carrier housing encapsulates the semiconductor die.
7. The semiconductor die carrier according to claim 1 , wherein the bond wiring comprises tape-automated bonding.
8. The semiconductor die carrier according to claim 1 , wherein the bond wiring comprises wire bonding.
9. The semiconductor die carrier according to claim 1 , wherein the carrier housing further comprises a floor.
10. The semiconductor die carrier according to claim 4 , wherein the semiconductor die is mounted to the cap.
11. The semiconductor die carrier according to claim 9 , wherein the semiconductor die is mounted to the floor.
12. The semiconductor die carrier according to claim 11 , wherein the floor comprises an indentation for receiving the semiconductor die.