IP Library › Assignment 020486/0488
Patent Assignment
Reel/Frame 020486/0488

Assignment of Assignor's Interest

Recorded: 2008-02-07 Pages: 5
Assignors
ZIMMERMAN, MICHAEL A.
Executed: 2008-01-08
HARRIS, JONATHAN
Executed: 2008-01-30
Assignee
QUANTUM LEAP PACKAGING, INC.
200 RESEARCH DRIVE, WILMINGTON, MASSACHUSETTS, 01887
Covered Property (1)
Microcircuit Package Having Ductile Layer
Patent: 7,679,185 →
Application: 11/983,813 →
Publication: US 2008/0128908
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 30, 2009
From: QUANTUM LEAP PACKAGING, INC.
To: INTERPLEXED ENGINEERED PRODUCTS, INC.
Reel/Frame 022892/0082 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded on Reel 022892 Frame 0082. Assignor(S) Hereby Confirms the Assignment. Jul 6, 2009
From: QUANTUM LEAP PACKAGING, INC.
To: INTERPLEX ENGINEERED PRODUCTS, INC.
Reel/Frame 022915/0962 →
Assignment of Assignor's Interest Jul 15, 2009
From: QUANTUM LEAP PACKAGING, INC.
To: INTERPLEX ENGINEERED PRODUCTS, INC.
Reel/Frame 022951/0884 →
Assignment of Assignor's Interest Jul 16, 2009
From: INTERPLEX ENGINEERED PRODUCTS, INC.
To: INTERPLEX QLP, INC.
Reel/Frame 022960/0406 →
Assignment of Assignor's Interest Apr 11, 2012
From: INTERPLEX QLP, INC.
To: IQLP, LLC
Reel/Frame 028028/0221 →
Assignment of Assignor's Interest Oct 18, 2019
From: IQLP, LLC
To: IONIC MATERIALS, INC.
Reel/Frame 050762/0154 →