IP Library › Assignment 050762/0154
Patent Assignment
Reel/Frame 050762/0154

Assignment of Assignor's Interest

Recorded: 2019-10-18 Pages: 6
Assignor
IQLP, LLC
Executed: 2019-10-18
Assignee
IONIC MATERIALS, INC.
10-M COMMERCE WAY, WOBURN, MASSACHUSETTS, 01801
Covered Properties (6)
Flange for Integrated Circuit Package
Patent: 7,053,299 →
Application: 10/920,660 →
Publication: US 2005/0012118
Package for Integrated Circuit Die
Patent: 6,867,367 →
Application: 10/767,309 →
Publication: US 2004/0184239
Ultra High-Temperature Plastic Package and Method of Manufacture
Patent: 7,803,307 →
Application: 11/146,856 →
Publication: US 2009/0295036
Microcircuit Package Having Ductile Layer
Patent: 43,807 →
Application: 13/348,934 →
Microcircuit Package Having Ductile Layer
Patent: 7,679,185 →
Application: 11/983,813 →
Publication: US 2008/0128908
Plastic Electronic Component Package
Patent: 8,039,945 →
Application: 12/950,528 →
Publication: US 2011/0064881
Related Assignments (12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 26, 2004
From: ZIMMERMAN, MICHAEL
To: QUANTUM LEAP PACKAGING, INC.
Reel/Frame 015133/0261 →
Assignment of Assignor's Interest Feb 7, 2008
From: ZIMMERMAN, MICHAEL A.; HARRIS, JONATHAN
To: QUANTUM LEAP PACKAGING, INC.
Reel/Frame 020486/0488 →
Assignment of Assignor's Interest Jun 30, 2009
From: QUANTUM LEAP PACKAGING, INC.
To: INTERPLEXED ENGINEERED PRODUCTS, INC.
Reel/Frame 022892/0082 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded on Reel 022892 Frame 0082. Assignor(S) Hereby Confirms the Assignment. Jul 6, 2009
From: QUANTUM LEAP PACKAGING, INC.
To: INTERPLEX ENGINEERED PRODUCTS, INC.
Reel/Frame 022915/0962 →
Assignment of Assignor's Interest Jul 15, 2009
From: QUANTUM LEAP PACKAGING, INC.
To: INTERPLEX ENGINEERED PRODUCTS, INC.
Reel/Frame 022951/0884 →
Assignment of Assignor's Interest Jul 16, 2009
From: INTERPLEX ENGINEERED PRODUCTS, INC.
To: INTERPLEX QLP, INC.
Reel/Frame 022960/0406 →
Assignment of Assignor's Interest Jul 27, 2010
From: ZIMMERMAN, MICHAEL
To: QUANTUM LEAP PACKAGING, INC.
Reel/Frame 024746/0705 →
Assignment of Assignor's Interest Mar 14, 2011
From: ZIMMERMAN, MICHAEL A.; SMITH, KEITH; SHVERDIN, JACOB
To: QUANTUM LEAP PACKAGING, INC.
Reel/Frame 025950/0033 →
Assignment of Assignor's Interest Mar 14, 2011
From: QUANTUM LEAP PACKAGING, INC.
To: INTERPLEX ENGINEERED PRODUCTS, INC.
Reel/Frame 025950/0129 →
Assignment of Assignor's Interest Mar 14, 2011
From: INTERPLEX ENGINEERED PRODUCTS, INC.
To: INTERPLEX QLP, INC.
Reel/Frame 025950/0313 →
Assignment of Assignor's Interest Apr 11, 2012
From: INTERPLEX QLP, INC.
To: IQLP, LLC
Reel/Frame 028028/0221 →
Assignment of Assignor's Interest Sep 18, 2024
From: IM1, LLC; IM2, LLC; IMH1, LLC; IMH2, LLC
To: TEXTILES COATED, INCORPORATED
Reel/Frame 068626/0541 →