Patent Assignment
Reel/Frame 015133/0261
Assignment of Assignor's Interest
Recorded: 2004-03-26
Pages: 3
Assignor
ZIMMERMAN, MICHAEL
Executed: 2004-01-30
Assignee
QUANTUM LEAP PACKAGING, INC.
200 RESEARCH DRIVE, WILMINGTON, MASSACHUSETTS, 01887
Covered Property
(1)
Package for Integrated Circuit Die
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 30, 2009
From: QUANTUM LEAP PACKAGING, INC.
To: INTERPLEXED ENGINEERED PRODUCTS, INC.
Reel/Frame 022892/0082 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded on Reel 022892 Frame 0082. Assignor(S) Hereby Confirms the Assignment.
Jul 6, 2009
From: QUANTUM LEAP PACKAGING, INC.
To: INTERPLEX ENGINEERED PRODUCTS, INC.
Reel/Frame 022915/0962 →
Assignment of Assignor's Interest
Jul 15, 2009
From: QUANTUM LEAP PACKAGING, INC.
To: INTERPLEX ENGINEERED PRODUCTS, INC.
Reel/Frame 022951/0884 →
Assignment of Assignor's Interest
Jul 16, 2009
From: INTERPLEX ENGINEERED PRODUCTS, INC.
To: INTERPLEX QLP, INC.
Reel/Frame 022960/0406 →
Assignment of Assignor's Interest
Apr 11, 2012
From: INTERPLEX QLP, INC.
To: IQLP, LLC
Reel/Frame 028028/0221 →
Assignment of Assignor's Interest
Oct 18, 2019
From: IQLP, LLC
To: IONIC MATERIALS, INC.
Reel/Frame 050762/0154 →
Assignment of Assignor's Interest
Sep 18, 2024
From: IM1, LLC; IM2, LLC; IMH1, LLC; IMH2, LLC
To: TEXTILES COATED, INCORPORATED
Reel/Frame 068626/0541 →