Patent Assignment
Reel/Frame 068626/0541
Assignment of Assignor's Interest
Recorded: 2024-09-18
Pages: 12
Assignors
IM1, LLC
Executed: 2024-08-16
IM2, LLC
Executed: 2024-08-16
IMH1, LLC
Executed: 2024-08-16
IMH2, LLC
Executed: 2024-08-16
IONIC MATERIALS, INC.
Executed: 2024-08-16
IONIC MATERIALS II, INC.
Executed: 2024-08-16
IM HOLDINGS I, INC.
Executed: 2024-08-16
IM HOLDINGS II, INC.
Executed: 2024-08-16
Assignee
TEXTILES COATED, INCORPORATED
6 GEORGE AVENUE, LONDONDERRY, NEW HAMPSHIRE, 03053
Covered Properties
(19)
RF circuit package
Application:
60/443,470 →
Methods for enclosing a thermoplastic package
Application:
10/920,643 →
Publication:
US 2005/0016750
Lead for integrated circuit package
Application:
10/920,957 →
Publication:
US 2005/0012186
Lcp Product for High Temperature Semi-Conductor Processes
Application:
62/259,320 →
Liquid Crystal Polymer Article for High Temperature Semiconductor Process
Application:
15/777,848 →
Publication:
US 2019/0062520
Liquid Crystal Polymer Battery Enclosure Material
Application:
62/505,389 →
Liquid Crystal Polymer Battery Enclosure Material
Application:
18/214,958 →
Publication:
US 2023/0344042
Liquid Crystal Polymer Composite, Liquid Crystal Polymer Composite Film, and Metal-Clad Laminate Including Same
Application:
63/128,564 →
Liquid Crystal Polymer Composite, Liquid Crystal Polymer Composite Film, and Metal-Clad Laminate Including Same
Application:
63/165,480 →
Liquid Crystal Polymer Composite, Liquid Crystal Polymer Composite Film, and Metal-Clad Laminate Including Same
Package for Integrated Circuit Die
Flange for Integrated Circuit Package
Thermoplastic Material
Thermoplastic Material
Liquid Crystal Polymer Battery Enclosure Material
Fackage for Integrated Circuit Die
PCT:
PCT/US2004/002464 ↗
Liquid Crystal Polymer Article for High Temperature Semiconductor Process
PCT:
PCT/US2016/063309 ↗
Liquid Crystal Polymer Enclosure Material
PCT:
PCT/US2018/032370 ↗
Liquid Crystal Polymer Composite, Liquid Crystal Polymer Composite Film, and Metal-Clad Laminate Including Same
PCT:
PCT/US2021/064627 ↗
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 10, 2003
From: ZIMMERMAN, MICHAEL
To: QUANTUM LEAP PACKAGING, LLC
Reel/Frame 013820/0572 →
Assignment of Assignor's Interest
Mar 26, 2004
From: ZIMMERMAN, MICHAEL
To: QUANTUM LEAP PACKAGING, INC.
Reel/Frame 015133/0261 →
Corrective Assignment to Correct the State of Incorporation from Massachusetts to Delaware, Previously Recorded at Reel 013820, Frame 0572.
Dec 5, 2005
From: ZIMMERMAN, MICHAEL
To: QUANTUM LEAP PACKAGING, LLC
Reel/Frame 017090/0907 →
Assignment of Assignor's Interest
Dec 12, 2005
From: QUANTUM LEAP PACKAGING, LLC
To: QUANTUM LEAP PACKAGING, INC.
Reel/Frame 017113/0620 →
Assignment of Assignor's Interest
Jun 30, 2009
From: QUANTUM LEAP PACKAGING, INC.
To: INTERPLEXED ENGINEERED PRODUCTS, INC.
Reel/Frame 022892/0082 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded on Reel 022892 Frame 0082. Assignor(S) Hereby Confirms the Assignment.
Jul 6, 2009
From: QUANTUM LEAP PACKAGING, INC.
To: INTERPLEX ENGINEERED PRODUCTS, INC.
Reel/Frame 022915/0962 →
Assignment of Assignor's Interest
Jul 15, 2009
From: QUANTUM LEAP PACKAGING, INC.
To: INTERPLEX ENGINEERED PRODUCTS, INC.
Reel/Frame 022951/0884 →
Assignment of Assignor's Interest
Jul 16, 2009
From: INTERPLEX ENGINEERED PRODUCTS, INC.
To: INTERPLEX QLP, INC.
Reel/Frame 022960/0406 →
Assignment of Assignor's Interest
Apr 15, 2010
From: QUANTUM LEAP PACKAGING, INC.
To: INTERPLEX ENGINEERED PRODUCTS, INC.
Reel/Frame 024236/0708 →
Assignment of Assignor's Interest
Apr 15, 2010
From: ZIMMERMAN, MICHAEL
To: QUANTUM LEAP PACKAGING, INC.
Reel/Frame 024236/0612 →
Assignment of Assignor's Interest
Apr 15, 2010
From: INTERPLEX ENGINEERED PRODUCTS, INC.
To: INTERPLEX QLP, INC.
Reel/Frame 024236/0804 →
Assignment of Assignor's Interest
Apr 11, 2012
From: INTERPLEX QLP, INC.
To: IQLP, LLC
Reel/Frame 028028/0221 →
Assignment of Assignor's Interest
Dec 17, 2015
From: ZIMMERMAN, MICHAEL A.; MAHONEY, F. MICHAEL; SCAVUZZO, WILLIAM S.
To: IONIC MATERIALS, INC.
Reel/Frame 037317/0344 →
Corrective Assignment to Correct the Title Previously Recorded on Reel 037317 Frame 0344. Assignor(S) Hereby Confirms the Assignment.
Jan 21, 2016
From: ZIMMERMAN, MICHAEL A.; MAHONEY, F. MICHAEL; SCAVUZZO, WILLIAM S.
To: IONIC MATERIALS, INC.
Reel/Frame 037568/0773 →
Assignment of Assignor's Interest
Nov 18, 2016
From: IONIC MATERIALS, INC.
To: IQLP LLC
Reel/Frame 040369/0561 →
Assignment of Assignor's Interest
Feb 16, 2018
From: ZIMMERMAN, MICHAEL A.; LEISING, RANDY
To: IQLP, LLC.
Reel/Frame 045356/0511 →
Assignment of Assignor's Interest
Jul 31, 2018
From: ZIMMERMAN, MICHAEL A; LEISING, RANDY
To: IQLP, LLC
Reel/Frame 046512/0179 →
Assignment of Assignor's Interest
Nov 15, 2018
From: ZIMMERMAN, MICHAEL A.; MAHONEY, F. MICHAEL; SCAVUZZO, WILLIAM S.
To: IQLP, LLC
Reel/Frame 047516/0380 →
Assignment of Assignor's Interest
Oct 18, 2019
From: IM HOLDINGS I, INC.
To: IONIC MATERIALS, INC.
Reel/Frame 050762/0064 →
Assignment of Assignor's Interest
Oct 18, 2019
From: IQLP, LLC
To: IM HOLDINGS II, INC.
Reel/Frame 050762/0114 →
Assignment of Assignor's Interest
Oct 18, 2019
From: IM HOLDINGS II, INC.
To: IONIC MATERIALS II, INC.
Reel/Frame 050762/0171 →
Assignment of Assignor's Interest
Oct 18, 2019
From: IQLP, LLC
To: IM HOLDINGS I, INC.
Reel/Frame 050761/0884 →
Assignment of Assignor's Interest
Oct 18, 2019
From: IQLP, LLC
To: IONIC MATERIALS, INC.
Reel/Frame 050762/0154 →
Assignment of Assignor's Interest
Apr 16, 2021
From: WELCH III, JOHN HENRY; HAU, KWONG YIU
To: IONIC MATERIALS, INC.
Reel/Frame 055946/0103 →
Assignment of Assignor's Interest
Sep 22, 2021
From: WELCH, JOHN HENRY, III
To: IONIC MATERIALS, INC.
Reel/Frame 057562/0327 →