Patent Assignment
Reel/Frame 017113/0620
Assignment of Assignor's Interest
Recorded: 2005-12-12
Pages: 3
Assignor
QUANTUM LEAP PACKAGING, LLC
Executed: 2005-12-12
Assignee
QUANTUM LEAP PACKAGING, INC.
200 RESEARCH DRIVE, WILMINGTON, MASSACHUSETTS, 01887
Covered Properties
(2)
RF circuit package
Application:
60/443,470 →
Ultra high temperature plastic package and method of manufacture
Application:
60/577,530 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 10, 2003
From: ZIMMERMAN, MICHAEL
To: QUANTUM LEAP PACKAGING, LLC
Reel/Frame 013820/0572 →
Assignment of Assignor's Interest
Jul 8, 2004
From: ZIMMERMAN, MICHAEL
To: QUANTUM LEAP PACKGING, LLC
Reel/Frame 015537/0750 →
Corrective Assignment to Correct the State of Incorporation from Massachusetts to Delaware, Previously Recorded at Reel 013820, Frame 0572.
Dec 5, 2005
From: ZIMMERMAN, MICHAEL
To: QUANTUM LEAP PACKAGING, LLC
Reel/Frame 017090/0907 →
Assignment of Assignor's Interest
Apr 11, 2012
From: INTERPLEX QLP, INC.
To: IQLP, LLC
Reel/Frame 028028/0221 →
Assignment of Assignor's Interest
Sep 18, 2024
From: IM1, LLC; IM2, LLC; IMH1, LLC; IMH2, LLC
To: TEXTILES COATED, INCORPORATED
Reel/Frame 068626/0541 →