Apparatus and method for reducing removal forces for CMP pads
View Patent ↗An improvement in a polishing apparatus for planarizing substrates comprises a tenacious coating of a low-adhesion material to the platen surface. An expendable polishing pad is adhesively attached to the low-adhesion material, and may be removed for periodic replacement at much reduced expenditure of force. Polishing pads joined to low-adhesion materials such as polytetrafluoroethylene (PTFE) by conventional adhesives resist distortion during polishing but are readily removed for replacement.
1. A method for polishing a work piece comprising:
directly adhesively attaching a polishing pad to an attachment surface of a platen, the attachment surface of the platen including a coating of a fluoropolymer material directly coated on at least a portion of a first surface thereof and directly attaching the polishing pad to the fluoropolymer material on the surface of the platen free of attachment of the polishing pad to a portion of the attachment surface of the platen without a coating of a fluoropolymer material on the attachment surface.
2. The method of claim 1 , wherein the fluoropolymer material comprises one of polytetrafluoroethylene (PTFE), polymonochlorotrifluoroethylene (CTFE) and polyvinylidene fluoride (PVF 2 ).
3. The method of claim 1 , wherein the platen comprises one of a metal and a ceramic material.
4. The method of claim 1 , wherein the platen comprises an aluminum material.
5. The method of claim 1 , wherein the first surface of the platen includes a plurality of channels for slurry flow formed therein.
6. The method of claim 1 , further comprising:
an adhesive material joining an attachment surface of the polishing pad to the coating of fluoropolymer material on at least a portion of the platen.
7. A method of attaching a polishing pad to a platen for polishing wafers comprising:
directly adhesively attaching a polishing pad to an attachment surface of a platen, the attachment surface of the platen including a coating of a fluoropolymer material directly coated on at least a portion of a first surface thereof and directly attaching the polishing pad to the fluoropolymer material on the attachment surface of the platen.
8. The method of claim 7 , wherein the platen is configured to rotate about an axis normal to the first surface of a rigid member.
9. The method of claim 7 , wherein the adhesive material is a pressure-sensitive adhesive material.
10. The method of claim 7 , wherein the fluoropolymer material comprises one of polytetrafluoroethylene (PTFE), polymonochlorotrifluoroethylene (CTFE) and polyvinylidene fluoride (PVF 2 ).
11. The method of claim 7 , wherein the platen has the first surface thereof configured for use in a chemical-mechanical polishing process using the polishing pad adhesively attached to the fluoropolymer material.
12. The method of claim 7 , wherein the first surface of the platen has a plurality of channels therein for passage of a slurry therethrough, the fluoropolymer material on an attachment surface of the platen configured for adhesive attachment of a polishing pad having apertures extending therethrough for discharge of the slurry onto a polishing surface.
13. A method of attaching a polishing pad to a platen for polishing wafers comprising:
coating a fluoropolymer material on at least a portion of a first surface of the platen for adhesive attachment of the polishing pad thereto, the fluoropolymer material comprising a roughened fluoropolymer coating to enhance adhesion between the fluoropolymer material and a pressure-sensitive adhesive material and directly attaching the polishing pad to the fluoropolymer material on the first surface of the platen.
14. A wafer polishing method comprising:
adhesively attaching a polishing pad directly to a platen including a coating of a fluoropolymer material on at least a portion of a first surface thereof and adhesively attaching the polishing pad directly to the fluoropolymer material on the first surface of the platen.
15. The method of claim 14 , wherein the fluoropolymer material comprises one of polytetrafluoroethylene (PTFE), polymonochlorotrifluoroethylene (CTFE) and polyvinylidene fluoride (PVF 2 ).
16. The method of claim 14 , wherein the platen comprises one of a metal and a ceramic material.
17. The method of claim 14 , wherein the platen comprises an aluminum material.
18. The method of claim 14 , wherein the first surface of the platen includes a plurality of channels for slurry flow formed therein.
19. The method of claim 14 , further comprising:
an adhesive material joining an attachment surface of the polishing pad to the coating of fluoropolymer material on at least a portion of the platen.
20. A platen for a polishing apparatus comprising:
a platen including a coating of a fluoropolymer material directly coated on at least a portion of a first surface thereof and a polishing pad directly adhesively attached to the fluoropolymer material on the first surface of the platen for a polishing process.
21. The platen of claim 20 , wherein the platen is configured to rotate about an axis normal to a substantially planar first surface.
22. The platen of claim 20 , wherein the adhesive material is a pressure-sensitive adhesive material.
23. The platen of claim 20 , wherein the fluoropolymer material comprises one of polytetrafluoroethylene (PTFE), polymonochlorotrifluoroethylene (CTFE) and polyvinylidene fluoride (PVF 2 ).
24. The platen of claim 20 , wherein the platen has a substantially planar first surface thereof configured for use in a chemical-mechanical polishing process using the polishing pad adhesively attached to the fluoropolymer material.
25. The platen of claim 20 , wherein a substantially planar first surface of the platen has a plurality of channels therein for passage of a slurry therethrough, the fluoropolymer material on the substantially planar first surface of the platen is configured for adhesive attachment of the polishing pad having apertures extending therethrough for discharge of the slurry onto a polishing surface.
26. A platen for a polishing apparatus comprising:
a platen including a coating of a fluoropolymer material coated on at least a portion of a first surface thereof and a polishing pad directly adhesively attached to the fluoropolymer material on the first surface of the platen for a polishing process, the fluoropolymer material comprising a roughened fluoropolymer coating to enhance adhesion between the fluoropolymer material and a pressure-sensitive adhesive material.
27. A platen in a polishing apparatus comprising:
a platen including a direct coating of a fluoropolymer material on at least a portion of a first surface thereof and a directly removable polishing pad adhesively attached to the fluoropolymer material on the first surface of the platen for a polishing process.
28. The platen of claim 27 , wherein the fluoropolymer material comprises one of polytetrafluoroethylene (PTFE), polymonochlorotrifluoroethylene (CTFE) and polyvinylidene fluoride (PVF 2 ).
29. The platen of claim 27 , wherein the platen comprises one of a metal and a ceramic material.
30. The platen of claim 27 , wherein the platen comprises an aluminum material.
31. The platen of claim 27 , wherein the first surface of the platen includes a plurality of channels for slurry flow formed therein.
32. The platen of claim 27 , further comprising:
an adhesive material joining an attachment surface of the polishing pad to the coating of fluoropolymer material on at least a portion of the platen.