Memory package
View Patent ↗A memory chip package with a controller die on a first side of a printed circuit board and a memory die on a second side of the same printed circuit board. The memory chip package is integrated into a microprocessor controlled device or alternatively is integrated into a portable memory card.
1. A method of making a memory chip package, the method comprising:
providing a circuit board having first and second opposing faces;
attaching a FLASH EEPROM having memory cells to the first face of the circuit board;
attaching a controller die having a control logic to the second face of the circuit board, and
configuring the controller die to read and write data to the memory cells on the first face; and
providing data lines within the circuit board connecting the controller die to the EEPROM, the data lines operable to transfer data to and from the memory cells.
2. A method of making a microprocessor controlled device, the method comprising:
providing a memory chip package comprising a circuit board having a first and second face;
attaching a controller die to the first face of the circuit board;
attaching a memory die to the second face of the circuit board;
providing a system bus;
providing one or more input-output devices electrically coupled to the system bus and the memory chip package;
providing random access memory electrically coupled to the system bus and the memory chip package; and
providing a microprocessor.
3. A method of making a memory card, comprising:
attaching a plurality of memory die to the first face of a first circuit board;
attaching a plurality of controller die to the second face of the first circuit board, each controller die positioned beneath a memory die;
laminating the second face of the first circuit board to a first face of a second circuit board having a plurality of recesses such that the plurality of controller die fit within the plurality of recesses;
forming vias in the first and second circuit boards connecting the controller die beneath the memory die to the memory die to form a plurality of memory packages;
cutting the first and second circuit boards between the plurality of memory packages to form individual memory packages; and
placing an individual memory package into a memory card body such that a set of contacts on one of the first or second circuit boards is exposed from the body in order to make contact with a memory card receptacle.
4. The method of claim 3 , wherein the memory die is of a NAND flash architecture.