Metal powder for electrically conductive paste and electrically conductive paste
View Patent ↗A metal powder for a conductive paste has an average particle diameter D50 not greater than 5 μm and an X value defined by equation (1) not greater than 0.5: X value= D 50 (μm)/BET specific surface area (m 2 /g) (1) The metal powder for a conductive paste is particularly preferable when wart-like projections of a diameter not greater than 150 nm are present on the particle surfaces. Typical types of the metal powder include Cu, Ag, Au, Pd, Pt, Ni, Al and alloys thereof. The metal powder for a conductive paste enables fabrication of a conductor having a low void ratio after the paste is fired.
1. A metal powder for a conductive paste comprising flaky particles whose average particle diameter D 50 is not greater than 5 μm, whose flake aspect ratio of individual particles defined by a particle major axis/thickness is 3 to 30, a proportion of the particles having an aspect ratio of less than 3 or greater than 30 being less than 10%, and whose X value defined by equation (1) below is not greater than 0.5:
X value= D 50 (μm)/BET specific surface area (m 2 /g) (1.
2. A metal powder for a conductive paste according to claim 1 , wherein wart-like projections of a diameter not greater than 150 nm are present on the particle surfaces.
3. A metal powder for a conductive paste according to claim 1 , wherein the metal powder is Cu powder.
4. A conductive paste using a metal powder set out in claim 1 .
5. A metal powder for a conductive paste according to claim 2 , wherein the metal powder is Cu powder.
6. A conductive paste using a metal powder set out in claim 2 .
7. A conductive paste using a metal powder set out in claim 3 .