Patent Assignment
Reel/Frame 020121/0161
Change of Name
Recorded: 2007-11-05
Pages: 33
Assignor
DOWA MINING CO., LTD.
Executed: 2006-10-02
Assignee
DOWA HOLDINGS CO., LTD.
4-14-1 SOTO-KANDA, CHIYODA-KU, TOKYO, JAPAN
Covered Properties
(120)
Power Module Circuit Board and a Process for the Manufacture Thereof
Patent:
6,013,357 →
Application:
08/917,328 →
Oxide Superconductor Current Lead and Method of Manufacturing the Same
Patent:
6,216,333 →
Application:
08/927,462 →
Metal-Ceramic Composite Substrates, Producing Methods Thereof and Brazing Materials for Use in Such Method
Patent:
6,221,511 →
Application:
09/036,855 →
Negative Electrode Active Material for Use in Alkaline Cell and Method of Preparing the Same
Application:
09/413,984 →
Publication:
US 2003/0129493
Metal-Ceramic Circuit Board
Hydrogen storage alloy and method for preparing the same
Application:
09/913,625 →
Insulating Substrate Boards for Semiconductor and Power Modules
Carburization Treatment Method
High purity gallium for producing compound semiconductor, refining process and apparatus for the same
Application:
10/134,381 →
Publication:
US 2002/0162419
Highly Oxidation-Resistant Copper Powder for Conductive Paste and Process for Producing the Powder
Power Module Member Manufactured by Wet Treatment, and Wet Treatment Method and Wet Treatment Equipment Thereof
Radiation Plate and Power Semiconductor Module Ic Package
Powder for Underlayer of Coating-Type Magnetic Recording Medium and Magnetic Recording Medium Comprising the Same
Powder for Underlayer of Coating-Type Magnetic Recording Medium
Method and Apparatus for Recovering Platinum Group Elements
Ferrite Magnetic Powder and Method for Production Thereof
Method for recovering platinum group elements
Application:
10/548,440 →
Publication:
US 2006/0213323
Magnetic Powder, a Magnetic Recording Medium Using the Magnetic Powder, and a Method of Surface Treating a Magnetic Powder
Particulate matter oxidation catalyst and filter
Application:
10/560,899 →
Publication:
US 2007/0105715
Powder for lower layer of application type of layered magnetic recording medium and magnetic recording medium using the same
Application:
10/563,111 →
Publication:
US 2006/0166040
Assemblages of Magnetic Alloy Nanoparticles (as Amended)
Metal-coated substrate and manufacturing method of the same
Application:
10/577,936 →
Publication:
US 2006/0292383
Sliding member having excellent seizure resistance and method for producing the same
Application:
10/609,556 →
Publication:
US 2004/0000492
Oxide superconductor thick film and method for manufacturing the same
Application:
10/630,862 →
Publication:
US 2004/0110641
Copper alloy having excellent corrosion cracking resistance and dezincing resistance, and method for producing same
Application:
10/644,217 →
Publication:
US 2005/0039827
Copper Base Alloy and Method for Producing Same
Metal/Ceramic Bonding Substrate and Method for Producing Same
Oxide Superconductor Current Lead and Method of Manufacturing the Same, and Superconducting System
Perovskite complex oxide and method of producing the same
Application:
10/803,963 →
Publication:
US 2004/0191150
Method for Producing Metal/Ceramic Bonding Substrate
Method of producing perovskite complex oxide and precursor substance used in the method
Application:
10/809,709 →
Publication:
US 2004/0247511
Magnetic metal powder and method of producing the powder
Application:
10/812,078 →
Publication:
US 2005/0051241
Bond Magnet and Ferrite Magnetic Powder for Bond Magnet
Copper alloy
Application:
10/829,946 →
Publication:
US 2004/0261913
Magnetic Metal Particle Aggregate and Method of Producing the Same
Fine Zirconium Oxide Powder and Method for Producing Same
Magnetic Powder
Manufacturing method and manufacturing device of metal clad film
Application:
10/915,364 →
Publication:
US 2005/0061423
Metal Member Coated with Metal Layers
Electronic Part Mounting Substrate and Method for Producing Same
Light Source Having Phosphor Including Divalent, Trivalent and Tetravalent Elements
Fine-Grain Silver Oxide Powder
Oxide superconductor thick film and method for manufacturing the same
Application:
10/941,896 →
Publication:
US 2005/0170969
Method for Producing Metal/Ceramic Bonding Circuit Board
Aluminum/Ceramic Bonding Substrate and Method for Producing Same
Hydrogen storage metal alloy and production thereof
Application:
10/959,216 →
Publication:
US 2005/0079090
Metal/Ceramic Bonding Substrate and Method for Producing Same
Phosphor Mixture and Light Emitting Device Using the Same
Iron Nitride Magnetic Powder and Method of Producing the Powder
Method of Making Ferromagnetic Iron Alloy Powder for Magnetic Recording Medium
Silver Powder and Method for Producing Same
Metal/ceramic bonding member and method for producing same
Application:
11/046,614 →
Publication:
US 2005/0175773
Phosphor Mixture and Light Emitting Device
Phosphor and Manufacturing Method Therefore, and Light Source Using the Phosphor
Iron Nitride Magnetic Powder and Method of Producing the Powder
Silver powder and method for producing same
Application:
11/066,345 →
Publication:
US 2005/0188788
Metal member and electric contact using same
Application:
11/071,816 →
Publication:
US 2005/0196634
Copper Particle Clusters and Powder Containing the Same Suitable as Conductive Filler of Conductive Paste
Aluminum bonding member and method for producing same
Application:
11/096,301 →
Publication:
US 2005/0217823
Spherical silver powder and method for producing same
Application:
11/132,980 →
Publication:
US 2005/0257643
Manufacturing Method of Metal Paste
Phosphor and Manufacturing Method of the Same, and Light Emitting Device Using the Phosphor
Phosphor and Manufacturing Method for the Same, and Light Emitting Device Using the Phosphor
Spherical silver powder and method for producing same
Application:
11/154,784 →
Publication:
US 2005/0279970
Composite Plated Product and Method for Producing Same
Zinc alloy powder for alkaline cell and method for producing same
Application:
11/159,810 →
Publication:
US 2006/0008704
Silver Oxide Powder for Alkaline Battery and Method of Producing the Same
Copper-based alloy and method of manufacturing same
Application:
11/169,760 →
Publication:
US 2006/0016528
Phosphor and Manufacturing Method for the Same, and Light Source
Perovskite complex oxide and catalyst
Application:
11/186,957 →
Publication:
US 2006/0018815
High-Weatherability Iron Nitride-Based Magnetic Powder and Method of Manufacturing the Powder
Phosphor and Phosphor Film for Electron Beam Excitation and Color Display Apparatus Using the Same
Powder of Fine Alloy Particles Having an Uneven Surface and Method of Manufacturing the Powder
Phosphor Mixture and Light Emitting Device
Face-Centered Cubic Structure Alloy Particles and Method of Manufacturing Same
Nonmagnetic Powder Comprising Acicular Iron and Having Specific Porosity for a Magnetic Recording Medium, Method of Manufacturing Same, and Magnetic Recording Medium Using Same
Aluminum/Ceramic Bonding Substrate
Phosphor and Manufacturing Method for the Same, and Light Source
Copper Alloy and Method of Manufacturing the Same
Phosphor and Manufacturing Method of the Same, and Light Emitting Device Using the Phosphor
Sintered Rare Earth Magnetic Alloy Wafer and Wafer Surface Growing Machine
Metal coated substrate and manufacturing method of the same
Application:
11/230,528 →
Publication:
US 2006/0093838
Tin-Plated Product
Magnetic powder for magnetic recording medium
Application:
11/249,411 →
Publication:
US 2007/0087229
Notched Compound Semiconductor Wafer
Notched Compound Semiconductor Wafer
Notched Compound Semiconductor Wafer
Circuit Board and a Power Module Employing the Same
Silver Powder and Method for Producing Same
Iron Nitride System Magnetic Powder Having Good Storage Stability
Battery Positive Electrode Material
Ferromagnetic Powder for a Magnetic Recording Medium, Method of Producing the Powder, and Magnetic Recording Medium Using the Powder
Plating Device and Plating Method
Display Device with a Transparent Optical Filter
Patent:
41,833 →
Application:
11/337,223 →
Metal Powder for Electrically Conductive Paste and Electrically Conductive Paste
Copper powder
Application:
11/355,888 →
Publication:
US 2006/0185474
Silver Particle Powder and Method of Manufacturing Same
Phosphor and Manufacturing Method of the Same, and Light Emitting Device Using the Phosphor
Ceramic Circuit Substrate and Manufacturing Method Thereof
Method of Producing Copper Powder and Copper Powder
Indium Oxide Powder and Method for Producing Same
Tin-plated product and method for producing same
Application:
11/378,124 →
Publication:
US 2006/0216475
Battery Positive Electrode Material
Heat Treatment Method and Heat Treatment Apparatus
Hydrogen Storage Metal Alloy and Production Thereof
Application:
11/426,262 →
Publication:
US 2006/0233659
Shot material for mechanical plating, and high corrosion resistant coating using same
Application:
11/436,588 →
Publication:
US 2006/0263622
Substrate for Film Growth of Group Iii Nitrides, Method of Manufacturing the Same, and Semiconductor Device Using the Same
Application:
11/467,319 →
Publication:
US 2007/0045662
Method of Manufacturing a Metal-Ceramic Circuit Board
Iron Compound Particles and Magnetic Recording Medium Using Same
A Method for Producing a Composite Plated Product.
Magnetic powder suitable for low-noise media
Application:
11/494,550 →
Publication:
US 2007/0042230
Method of Forming Group-Iii Nitride Crystal, Layered Structure and Epitaxial Substrate
Ferromagnetic Powder, and Coating Material and Magnetic Recording Medium Using Same
Magnetic Material, and Memory and Sensor Using Same
Aluminum/Ceramic Bonding Substrate and Method for Producing Same
Apparatus, Mold, and Method for Manufacturing Metal-Ceramic Composite Member
Oxide Superconductor Thick Film and Method for Manufacturing the Same
Electronic Part Mounting Substrate and Method for Producing Same
Ferrite Magnet Powder Bond Magnet
A Silver Powder.
Related Assignments
(24)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 23, 1997
From: KOJIMA, MASAHIRO; HASEYAMA, SHUETSU; YOSHIZAWA, SHUJI; SATO, MAMORU
To: DOWA MINING CO., LTD.
Reel/Frame 009099/0770 →
Assignment of Assignor's Interest
Mar 9, 1998
From: SAKURABA, MASAMI; KIMURA, MASAMI; TAKAHARA, MASAYA; NAKAMURA, JUNJI
To: DOWA MINING CO., LTD.
Reel/Frame 009066/0589 →
Assignment of Assignor's Interest
Apr 27, 1998
From: SAKURABA, MASAMI; KIMURA, MASAMI; NAKAMURA, JUNJI; TAKAHARA, MASAYA
To: DOWA MINING CO., LTD.
Reel/Frame 009144/0903 →
Assignment of Assignor's Interest
Oct 7, 1999
From: KITAMURA, TOSHIYA
To: DOWA MINING CO., LTD.
Reel/Frame 010307/0129 →
Assignment of Assignor's Interest
May 3, 2001
From: OSANAI, HIDEYO; FURO, MASAHIRO
To: DOWA MINING CO., LTD.
Reel/Frame 011776/0922 →
Assignment of Assignor's Interest
Aug 16, 2001
From: OKADA, MASUO; KURIIWA, TAKAHIRO
To: TOHOKU TECHNO ARCH CO., LTD.
Reel/Frame 012258/0944 →
Assignment of Assignor's Interest
Mar 1, 2002
From: FURO, MASAHIRO; OSANAI, HIDEYO
To: DOWA MINING CO., LTD.
Reel/Frame 012668/0716 →
Assignment of Assignor's Interest
May 28, 2002
From: EBIHARA, HISASHI; TAKAHASHI, JUN; ABUKAWA, FUMITAKA; YOKOSE, KEIJI
To: DOWA MINING CO., LTD.
Reel/Frame 012934/0111 →
Assignment of Assignor's Interest
Jul 9, 2003
From: OKADA, YOSHIHIRO; EBARA, ATSUSHI
To: DOWA MINING CO., LTD.
Reel/Frame 014248/0095 →
Assignment of Assignor's Interest
Jul 28, 2003
From: IYODA, KEN; NAMIOKA, MAKOTO; OSANAI, HIDEYO; SHIMADA, SUSUMU
To: DOWA MINING CO., LTD.
Reel/Frame 013836/0360 →
Assignment of Assignor's Interest
May 17, 2004
From: ENDOU, HIDEKI; YANASE, SHINGO
To: DOWA MINING CO. LTD.
Reel/Frame 015332/0189 →
Assignment of Assignor's Interest
Oct 20, 2004
From: MATSUMOTO, KAZUYUKI; INOUE, KENICHI; INOUE, KEN
To: DOWA MINING CO., LTD.
Reel/Frame 015270/0852 →
Assignment of Assignor's Interest
Nov 8, 2004
From: MATSUMOTO, KAZUYUKI; INOUE, KENICHI; INOUE, KEN
To: DOWA MINING CO., LTD.
Reel/Frame 015343/0280 →
Assignment of Assignor's Interest
Mar 25, 2005
From: YAMADA, KOJI; OGINO, MASAHIKO; EZAWA, NOBUYASU; INOUE, HIROSHI
To: DOWA MINING CO., LTD.; TANAKA KIKINZOKU KOGYO K.K.; KOSAKA SMELTING & REFINING CO., LTD.; NIPPON PGM CO., LTD.
Reel/Frame 015821/0589 →
Transfer of 25% Interest to Masuo Okada and Transfer of 25% Interest to Dowa Mining Co., Ltd. Assignee Retains 50% Interest
Apr 1, 2005
From: TOHOKU TECHNO ARCH CO., LTD.
To: OKADA, MASUO; DOWA MINING CO., LTD.
Reel/Frame 016418/0344 →
Assignment of Assignor's Interest
Jul 29, 2005
From: SENDA, MASAYASU; SUENAGA, SHINICHI; KATAYAMA, HIDEKI
To: DOWA MINING CO., LTD.; NIPPON BENGARA KOGYO CO., LTD.
Reel/Frame 016327/0863 →
Assignment of Assignor's Interest
Jan 24, 2006
From: SATO, KIMITAKA
To: DOWA MINING CO., LTD.
Reel/Frame 017056/0889 →
Assignment of Assignor's Interest
Feb 14, 2006
From: KONNO, SHINICHI; INOUE, KENICHI; INOUE, KEN; IIHOSHI, HIROSHI
To: DOWA MINING CO., LTD.
Reel/Frame 017168/0487 →
Assignment of Assignor's Interest
Apr 4, 2006
From: SUDA, HISASHI; YANO, TAKUYA
To: DOWA MINING CO., LTD.
Reel/Frame 017420/0626 →
Assignment of Assignor's Interest
Nov 13, 2006
From: YAMADA, KOJI; TAYAMA, KENICHI; EZAWA, NOBUYASU; INOUE, HIROSHI
To: DOWA MINING CO., LTD.; TANAKA KIKINZOKU KOGYO K.K.; KOSAKA SMELTING & REFINING CO., LTD.; NIPPON PGM CO., LTD.
Reel/Frame 018508/0962 →
Assignment of Assignor's Interest
Jan 7, 2008
From: DOWA HOLDINGS CO., LTD.
To: DOWA ELECTRONICS MATERIALS CO., LTD.
Reel/Frame 020323/0715 →
Assignment of Assignor's Interest
Jan 11, 2008
From: DOWA HOLDINGS CO., LTD.
To: DOWA THERMOTECH CO., LTD.
Reel/Frame 020354/0757 →
Assignment of Assignor's Interest
Jan 11, 2008
From: DOWA HOLDINGS CO., LTD.
To: DOWA METALTECH CO., LTD.
Reel/Frame 020354/0632 →
Assignment of Assignor's Interest
Jan 11, 2008
From: DOWA HOLDINGS CO., LTD.
To: DOWA METALS & MINING CO., LTD.
Reel/Frame 020354/0537 →