Aluminum/ceramic bonding substrate
View Patent ↗There is provided an aluminum/ceramic bonding substrate having a high reliability to high-temperature heat cycles. An aluminum member of an aluminum alloy having a Vickers hardness of 35 to 45 is bonded to a ceramic substrate having a flexural strength of 500 to 600 MPa in three-point bending. The ceramic substrate is made of high-strength aluminum nitride, silicon nitride, alumina containing zirconia, or high-purity alumina. The aluminum alloy is an aluminum alloy containing silicon and boron, or an aluminum alloy containing copper.
1. An aluminum/ceramic bonding substrate comprising:
a ceramic substrate having a flexural strength of 450 MPa or more in three-point bending; and
an aluminum member bonded to said ceramic substrate, said aluminum member having a Vickers hardness of 32 to 49,
wherein said aluminum member is made of an aluminum alloy containing contains 0.6 to 3.0 wt % of silicon and 0.01 to 1.0 wt % of boron.
2. An aluminum/ceramic bonding substrate as set forth in claim 1 , wherein said Vickers hardness of said aluminum member is in the range of from 35 to 45.
3. An aluminum/ceramic bonding substrate as set forth in claim 1 , wherein said flexural strength of said ceramic substrate is 470 MPa or more.
4. An aluminum/ceramic bonding substrate as set forth in claim 1 , wherein said flexural strength of said ceramic substrate is 500 MPa or more.
5. An aluminum/ceramic bonding substrate as set forth in claim 1 , wherein said aluminum alloy contains 1.0 to 2.0 wt % of silicon and 0.03 to 0.05 wt % of boron.
6. An aluminum/ceramic bonding substrate as set forth in claim 1 , wherein said ceramic substrate is made of a ceramic selected from the group consisting of aluminum nitride, silicon nitride, alumina containing zirconia, and high-purity alumina.
7. An aluminum/ceramic bonding substrate as set forth in claim 1 , wherein said aluminum member directly contacts said ceramic substrate to be bonded thereto.
8. An aluminum/ceramic bonding substrate as set forth in claim 1 , wherein said aluminum member is bonded to said ceramic substrate via a brazing material.
9. An aluminum/ceramic bonding substrate as set forth in claim 1 , which is used as a circuit board for mounting thereon a semiconductor chip.
10. An aluminum/ceramic bonding substrate as set forth in claim 9 , wherein said semiconductor chip is made of SiC, AlGaN or GaN.
11. An aluminum/ceramic bonding substrate as set forth in claim 1 , which is used as a circuit board for an inverter or converter.
12. An aluminum/ceramic bonding substrate as set forth in claim 1 , which is used as a circuit board for automotive parts.