IP Library › Assignment 016910/0698
Patent Assignment
Reel/Frame 016910/0698

Assignment of Assignor's Interest

Recorded: 2005-08-19 Pages: 2
Assignor
OSANAI, HIDEYO
Executed: 2005-08-12
Assignee
DOWA MINING CO., LTD.
8-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-8282, JAPAN
Covered Property (1)
Aluminum/Ceramic Bonding Substrate
Patent: 7,304,378 →
Application: 11/208,246 →
Publication: US 2006/0043574
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 5, 2007
From: DOWA MINING CO., LTD.
To: DOWA HOLDINGS CO., LTD.
Reel/Frame 020121/0161 →
Assignment of Assignor's Interest Jan 11, 2008
From: DOWA HOLDINGS CO., LTD.
To: DOWA METALTECH CO., LTD.
Reel/Frame 020354/0632 →