Patent Assignment
Reel/Frame 020354/0632
Assignment of Assignor's Interest
Recorded: 2008-01-11
Pages: 5
Assignor
DOWA HOLDINGS CO., LTD.
Executed: 2007-11-21
Assignee
DOWA METALTECH CO., LTD.
4-14-1 SOTO-KANDA, CHIYODA-KU, TOKYO, JAPAN
Covered Properties
(33)
Power Module Circuit Board and a Process for the Manufacture Thereof
Patent:
6,013,357 →
Application:
08/917,328 →
Metal-Ceramic Composite Substrates, Producing Methods Thereof and Brazing Materials for Use in Such Method
Patent:
6,221,511 →
Application:
09/036,855 →
Metal-Ceramic Circuit Board
Insulating Substrate Boards for Semiconductor and Power Modules
Power Module Member Manufactured by Wet Treatment, and Wet Treatment Method and Wet Treatment Equipment Thereof
Radiation Plate and Power Semiconductor Module Ic Package
Copper alloy having excellent corrosion cracking resistance and dezincing resistance, and method for producing same
Application:
10/644,217 →
Publication:
US 2005/0039827
Copper Base Alloy and Method for Producing Same
Metal/Ceramic Bonding Substrate and Method for Producing Same
Method for Producing Metal/Ceramic Bonding Substrate
Copper alloy
Application:
10/829,946 →
Publication:
US 2004/0261913
Metal Member Coated with Metal Layers
Electronic Part Mounting Substrate and Method for Producing Same
Method for Producing Metal/Ceramic Bonding Circuit Board
Aluminum/Ceramic Bonding Substrate and Method for Producing Same
Metal/Ceramic Bonding Substrate and Method for Producing Same
Metal/ceramic bonding member and method for producing same
Application:
11/046,614 →
Publication:
US 2005/0175773
Metal member and electric contact using same
Application:
11/071,816 →
Publication:
US 2005/0196634
Aluminum bonding member and method for producing same
Application:
11/096,301 →
Publication:
US 2005/0217823
Composite Plated Product and Method for Producing Same
Copper-based alloy and method of manufacturing same
Application:
11/169,760 →
Publication:
US 2006/0016528
Aluminum/Ceramic Bonding Substrate
Copper Alloy and Method of Manufacturing the Same
Tin-Plated Product
Circuit Board and a Power Module Employing the Same
Plating Device and Plating Method
Ceramic Circuit Substrate and Manufacturing Method Thereof
Tin-plated product and method for producing same
Application:
11/378,124 →
Publication:
US 2006/0216475
Method of Manufacturing a Metal-Ceramic Circuit Board
A Method for Producing a Composite Plated Product.
Aluminum/Ceramic Bonding Substrate and Method for Producing Same
Apparatus, Mold, and Method for Manufacturing Metal-Ceramic Composite Member
Electronic Part Mounting Substrate and Method for Producing Same
Related Assignments
(22)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 9, 1998
From: SAKURABA, MASAMI; KIMURA, MASAMI; TAKAHARA, MASAYA; NAKAMURA, JUNJI
To: DOWA MINING CO., LTD.
Reel/Frame 009066/0589 →
Assignment of Assignor's Interest
Apr 27, 1998
From: SAKURABA, MASAMI; KIMURA, MASAMI; NAKAMURA, JUNJI; TAKAHARA, MASAYA
To: DOWA MINING CO., LTD.
Reel/Frame 009144/0903 →
Assignment of Assignor's Interest
May 3, 2001
From: OSANAI, HIDEYO; FURO, MASAHIRO
To: DOWA MINING CO., LTD.
Reel/Frame 011776/0922 →
Assignment of Assignor's Interest
Mar 1, 2002
From: FURO, MASAHIRO; OSANAI, HIDEYO
To: DOWA MINING CO., LTD.
Reel/Frame 012668/0716 →
Assignment of Assignor's Interest
Jul 28, 2003
From: IYODA, KEN; NAMIOKA, MAKOTO; OSANAI, HIDEYO; SHIMADA, SUSUMU
To: DOWA MINING CO., LTD.
Reel/Frame 013836/0360 →
Assignment of Assignor's Interest
Aug 20, 2003
From: YAMAGISHI, YOSHINORI; DONG, SHU-XIN
To: DOWA MINING CO., LTD.
Reel/Frame 014416/0451 →
Assignment of Assignor's Interest
Sep 22, 2003
From: INOHANA, YASUO; SUGAWARA, AKIRA; SATO, TOSHIHIRO
To: DOWA MINING CO., LTD.
Reel/Frame 014536/0499 →
Assignment of Assignor's Interest
Dec 29, 2003
From: OSANAI, HIDEYO; IBARAKI, SUSUMU; IYODA, KEN; NAMIOKA, MAKOTO
To: DOWA MINING CO., LTD.
Reel/Frame 014855/0706 →
Assignment of Assignor's Interest
Mar 22, 2004
From: NAKAMURA, JUNJI
To: DOWA MINING CO., LTD.
Reel/Frame 015130/0219 →
Assignment of Assignor's Interest
May 17, 2004
From: ENDOU, HIDEKI; YANASE, SHINGO
To: DOWA MINING CO. LTD.
Reel/Frame 015332/0189 →
Assignment of Assignor's Interest
Aug 10, 2004
From: HAKETA, NAOKI
To: DOWA MINING CO., LTD.
Reel/Frame 015685/0163 →
Assignment of Assignor's Interest
Aug 24, 2004
From: OSANAI, HIDEYO
To: DOWA MINING CO., LTD.
Reel/Frame 015738/0459 →
Assignment of Assignor's Interest
Aug 27, 2004
From: ISHIDA KIYOHITO; KAINUMA, RYOSUKE; KIMURA, TAKASHI; MIURA, MICHIO
To: KIYOHITO ISHIDA; YAMAHA METANIX CORPORATION; DOWA MINING CO., LTD.
Reel/Frame 015742/0248 →
Assignment of Assignor's Interest
Sep 22, 2004
From: OSANAI, HIDEYO; NAMIOKA, MAKOTO; IBARAKI, SUSUMU
To: DOWA MINING CO., LTD.
Reel/Frame 015831/0137 →
Assignment of Assignor's Interest
Sep 29, 2004
From: OSANAI, HIDEYO; IDEGUCHI, SATORU
To: DOWA MINING CO., LTD.
Reel/Frame 015858/0527 →
Assignment of Assignor's Interest
Oct 12, 2004
From: OSANAI, HIDEYO; TAKAHASHI, TAKAYUKI; NAMIOKA, MAKOTO
To: DOWA MINING CO., LTD.
Reel/Frame 015892/0173 →
Assignment of Assignor's Interest
Jan 28, 2005
From: TSUKAGUCHI, NOBUYOSHI; IYODA, KEN
To: DOWA MINING CO., LTD.
Reel/Frame 016241/0102 →
Assignment of Assignor's Interest
Mar 3, 2005
From: ABE, NAOKI; NISHINA, MASAYUKI; MIYAZAWA, HIROSHI
To: DOWA MINING CO., LTD.
Reel/Frame 016354/0947 →
Assignment of Assignor's Interest
Mar 31, 2005
From: OSANAI, HIDEYO
To: DOWA MINING CO., LTD.
Reel/Frame 016452/0975 →
Corrective Assignment to Correct the Address of the First Assignee. Document Previously Recorded at Reel 015742 Frame 0248.
Apr 28, 2005
From: ISHIDA, KIYOHITO; KAINUMA, RYOSUKE; KIMURA, TAKASHI; MIURA, MICHIO
To: ISHIDA, KIYOHITO; YAMAHA METANIX CORPORATION; DOWA MINING CO., LTD.
Reel/Frame 016503/0248 →
Assignment of Assignor's Interest
Nov 9, 2005
From: HARA, MASAHIRO; OSANAI, HIDEYO
To: DOWA MINING CO., LTD.
Reel/Frame 017227/0274 →
Change of Name
Nov 5, 2007
From: DOWA MINING CO., LTD.
To: DOWA HOLDINGS CO., LTD.
Reel/Frame 020121/0161 →