Metal/ceramic bonding substrate and method for producing same
View Patent ↗There is provided a metal/ceramic bonding substrate capable of preventing the reverse thereof from greatly warping so as to be concave even if it is heated for soldering. In the metal/ceramic bonding substrate, a metal circuit plate 12 is bonded to one side of a ceramic substrate 10 , and a heat sink plate (metal base plate) 14 is bonded to the other side thereof. On the heat sink plate 14 , a work-hardened layer 16 is formed by shot peening. On the metal circuit plate 12 of the metal/ceramic bonding substrate, semiconductor chips (Si chips) 18 are soldered (solder layer 20 ). Then, a power module is produced by a predetermined process. On the reverse (the side of the work-hardened layer 16 ) of the power module, a radiating fin 26 is mounted via a thermal grease 24 by means of screws 22 or the like.
1. A metal/ceramic bonding substrate comprising:
a ceramic substrate;
a metal circuit plate bonded to one side of said ceramic substrate; and
a heat sink plate of a metal, one surface of the heat sink plate being bonded to the other side of said ceramic substrate, and another surface of the heat sink plate comprising a work-hardened surface of said metal of said heat sink plate for mounting thereon a radiating or cooling means.
2. A metal/ceramic bonding substrate as set forth in claim 1 , wherein said work-hardened layer is formed by shot peening.
3. A metal/ceramic bonding substrate as set forth in claim 1 , wherein a warpage of the another surface of said heat sink plate is −200 micrometers or more, assuming that said warpage is a difference in height between a center and edge of the another surface of said heat sink plate and is positive (+) when the other side of said heat sink plate warps so as to be convex and negative (−) when the another surface of said heat sink plate warps so as to be concave.
4. A metal/ceramic bonding substrate as set forth in claim 1 , wherein a warpage of the another surface of said heat sink plate is in the range of from −100 to +500 micrometers, assuming that said warpage is a difference in height between a center and edge of the another surface of said heat sink plate and is positive (+) when the another surface of said heat sink plate warps so as to be convex and negative (−) when the another surface of said heat sink plate warps so as to be concave.
5. A metal/ceramic bonding substrate as set forth in claim 1 , wherein a warpage of the another surface of said heat sink plate is in the range of from 0 to +200 micrometers, assuming that said warpage is a difference in height between a center and edge of the another surface of said heat sink plate and is positive (+) when the another surface of said heat sink plate warps so as to be convex and negative (−) when the another surface of said heat sink plate warps so as to be concave.
6. A metal/ceramic bonding substrate as set forth in claim 1 , wherein said metal circuit plate and said heat sink plate contact said ceramic substrate to be bonded directly to said ceramic substrate.
7. A metal/ceramic bonding substrate as set forth in claim 6 , wherein said metal is aluminum or an aluminum alloy.
8. A power module comprising:
a metal/ceramic bonding substrate as set forth in claim 1 ; and
a semiconductor chip soldered on said metal circuit plate of said metal/ceramic bonding substrate.
9. A metal/ceramic bonding substrate as set forth in claim 1 , wherein said metal is aluminum or an aluminum alloy.
10. A metal/ceramic bonding substrate as set forth in claim 1 , wherein said metal is copper.