IP Library › Assignment 014855/0706
Patent Assignment
Reel/Frame 014855/0706

Assignment of Assignor's Interest

Recorded: 2003-12-29 Pages: 2
Assignors
OSANAI, HIDEYO
Executed: 2003-12-19
IBARAKI, SUSUMU
Executed: 2003-12-22
IYODA, KEN
Executed: 2003-12-19
NAMIOKA, MAKOTO
Executed: 2003-12-19
Assignee
DOWA MINING CO., LTD.
8-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO 100-8282, JAPAN
Covered Property (1)
Metal/Ceramic Bonding Substrate and Method for Producing Same
Patent: 7,256,353 →
Application: 10/747,837 →
Publication: US 2004/0144561
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 5, 2007
From: DOWA MINING CO., LTD.
To: DOWA HOLDINGS CO., LTD.
Reel/Frame 020121/0161 →
Assignment of Assignor's Interest Jan 11, 2008
From: DOWA HOLDINGS CO., LTD.
To: DOWA METALTECH CO., LTD.
Reel/Frame 020354/0632 →