Assignment of Assignor's Interest

Recorded: 2004-03-22 Pages: 2

Assignor

NAKAMURA, JUNJI

Executed: 2004-03-16

Assignee

DOWA MINING CO., LTD.

8-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-8282, JAPAN

Covered Property (1)

Method for Producing Metal/Ceramic Bonding Substrate

Patent: 7,219,826 →

Application: 10/805,768 →

Publication: US 2004/0262367

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.