Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof
View Patent ↗The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plate 13 is bonded on a part of a ceramic substrate 12 so as to expose an outer peripheral edge portion of the ceramic substrate 12 in an integrally bonded member 10 , the integrally bonded member 10 is set on a treating apparatus 30 while being covered with a masking member 20 having a window portion 22 from which the circuit pattern forming metal plate 13 of the integrally bonded member 10 is exposed. Further, the integrally bonded member 10 is pressed with an appropriate pressure from a base plate 11 side so that a boundary surface between a portion 23 surrounding the window portion in the masking member and an exposed surface 16 of the ceramic substrate which is exposed in a metal-ceramic bonded member 14 has a state not allowing a liquid to pass therethrough. Thereafter, a treatment solution 33 for wet treatment is injected from an injection pipe 35 to be in contact with the circuit pattern forming metal plate 13.
1. A wet treatment method of a metal-ceramic bonded member for wet-treating the metal-ceramic bonded member having a metal circuit plate bonded on one surface of a ceramic substrate by using a wet treatment equipment, the method comprising:
bonding a metal plate for the metal circuit plate to one surface of said ceramic substrate, so that an outer peripheral edge portion of the surface of said ceramic substrate is exposed having a width;
providing a protective pattern having a resistance against etching solution on said metal plate, according to a desired metal circuit pattern;
making a metal-ceramic bonded member covered with a masking member having a square shape with a recessed portion in a center thereof or a plate shape, and having a window portion from which said metal plate is exposed,
making the metal-ceramic bonded member covered with said masking member so that said metal plate is exposed and the surface of the outer peripheral edge portion of the ceramic substrate of said metal-ceramic bonded member is brought into contact with a surrounding part of the window portion of said masking member; and
installing this metal-ceramic bonded member on an opening part provided in an upper part of said wet-treatment equipment, in a state that a surface exposed from the window portion of said masking member and bonded with said metal plate is directed downward;
pressing a part of the masking member, where the masking member and the outer peripheral edge portion of one surface of the ceramic substrate are in contact with each other, against the outer peripheral edge portion of one surface of the ceramic substrate, by pressing the metal-ceramic bonded member from an opposite side of the surface bonded with the metal plate, wherein a pressing portion forms the window portion; and
making a treatment solution for wet-treating the metal circuit plate come in contact with the metal plate to form the desired metal circuit pattern.
2. A wet treatment method of a metal-ceramic bonded member according to claim 1 ,
wherein said treatment solution is an etching solution for said circuit pattern forming metal plate, and
wherein the circuit pattern forming metal plate of said metal-ceramic bonded member is covered with the masking member having the window portion from which said circuit pattern forming metal plate is exposed, after a protection pattern having a resistance to said etching solution is formed on a desired portion.
3. A wet treatment method of a metal-ceramic bonded member according to claim 2 ,
wherein an appropriate resist is applied to or an appropriate film is laminated on said circuit pattern forming metal plate to form said protection pattern.
4. A wet treatment method of a metal-ceramic bonded member type according to claim 1 ,
wherein said treatment solution is a plating solution for said circuit pattern forming metal plate.
5. A wet treatment method of a metal-ceramic bonded member type according to claim 1 ,
wherein said treatment solution is a plating solution for said circuit pattern forming metal plate, and
wherein the circuit pattern forming metal plate of said metal-ceramic bonded member is covered with the masking member having the window portion from which said circuit pattern forming metal plate is exposed, after a protection pattern preventing plating with said plating solution is formed on a desired portion.
6. The wet treatment method of a metal-ceramic bonded member according to claim 1 , which uses the masking member having a base part not liable to substantially become deformed even if a load is applied, prescribed numbers of elastic members set in prescribed places of the base part, and a pressing part that becomes deformed in accordance with the load when elastically supported on the base part and the load is applied.
7. The wet treatment method of the metal-ceramic bonded member according to claim 1 , wherein a width of an outer peripheral edge portion of one side of the metal-ceramic bonded member is set at 0.5 mm to 1.5 mm, and by pressing the part where the masking member and the outer peripheral edge portion of one side of the ceramic substrate are in contact with each other, against the outer peripheral edge portion of one side of the ceramic substrate.
8. The wet treatment method of the metal-ceramic bonded member according to claim 1 , wherein the masking member is composed of any one of silicon rubber, fluorine rubber, polypropylene or teflon.
9. A wet treatment method of a metal-ceramic bonded member for wet-treating a base integral type metal-ceramic bonded member having a metal circuit plate bonded on one surface and a base member bonded on the other surface of a ceramic substrate, by using a wet treatment equipment, the method comprising:
bonding a metal plate for the metal circuit plate to one surface of said ceramic substrate, so that an outer peripheral edge portion of the surface of said ceramic substrate is exposed, having a width;
bonding a base member to the other surface of said ceramic substrate so that said base member is exposed,
providing a protective pattern having a resistance against etching solution on said metal plate, according to a desired metal circuit pattern;
making a base plate, being a base member of an outer periphery of the ceramic substrate of said metal-ceramic bonded member, covered with a masking member having a square shape provided with a recessed portion in a center thereof or a plate shape, and having a window portion from which said metal plate and said ceramic substrate are exposed, so that said metal plate is exposed and a surrounding part of the window portion of said masking member is brought into contact with this base plate;
installing this metal-ceramic bonded member on an opening part provided in an upper part of said wet-treatment equipment, in a state that a surface exposed from the window portion of said masking member and bonded with said metal plate is directed downward;
pressing a part of the masking member, where the masking member and the base plate are in contact with each other, against the base member of the outer peripheral edge portion of said ceramic substrate, by pressing the metal-ceramic bonded member from an opposite side of the surface bonded with the metal plate; and
making a treatment solution for wet-treating the metal plate come in contact with the metal plate to form the desired metal circuit pattern.
10. A wet treatment method of a metal-ceramic bonded member of a base integral type according to claim 9 , wherein said base member has a plate shape or a fin structure.
11. A wet treatment method of a metal-ceramic bonded member and a metal-ceramic bonded member of a base integral type according to claim 9 ,
wherein said treatment solution is an etching solution for said circuit pattern forming metal plate, and
wherein the circuit pattern forming metal plate of said metal-ceramic bonded member is covered with the masking member having the window portion from which said circuit pattern forming metal plate is exposed, after a projection pattern having a resistance to said etching solution is formed on a desired portion.
12. A wet treatment method of metal-ceramic bonded member and a metal-ceramic bonded member of a base integral type according to claim 9 ,
wherein said treatment solution is a plating solution for said circuit pattern forming metal plate.
13. A wet treatment method of a metal-ceramic bonded member and a metal-ceramic bonded member of a base integral type according to claim 9 ,
wherein said treatment solution is a plating solution for said circuit pattern forming metal plate, and
wherein the circuit pattern forming metal plate of said metal-ceramic bonded member is covered with the masking member having the window portion from which said circuit pattern forming metal plate is exposed, after a protection pattern preventing plating with said plating solution is formed on a desired portion.
14. The wet treatment method of a metal-ceramic bonded member according to claim 9 , which uses the masking member having a base part not liable to substantially become deformed even if a load is applied, prescribed numbers of elastic members set in prescribed places of the base part, and a pressing part that becomes deformed in accordance with the load when elastically supported on the base part and the load is applied.
15. The wet treatment method of the metal-ceramic bonded member according to claim 9 , wherein a width of an outer peripheral edge portion of one side of the metal-ceramic bonded member is set at 0.5 mm to 1.5 mm, and by pressing the part where the masking member and the outer peripheral edge portion of one side of the ceramic substrate are in contact with each other, against the outer peripheral edge portion of one side of the ceramic substrate.
16. The wet treatment of method of the metal-ceramic bonded member according to claim 9 , wherein the masking member is composed of any one of silicon rubber, fluorine rubber, polypropylene or teflon.