Assignment of Assignor's Interest

Recorded: 2004-08-24 Pages: 2

Assignor

OSANAI, HIDEYO

Executed: 2004-08-03

Assignee

DOWA MINING CO., LTD.

8-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, CHIYODA-KU, TOKYO, 100-8282, JAPAN

Covered Property (1)

Electronic Part Mounting Substrate and Method for Producing Same

Patent: 7,159,310 →

Application: 10/925,640 →

Publication: US 2005/0047101

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.