IP Library › Assignment 015831/0137
Patent Assignment
Reel/Frame 015831/0137

Assignment of Assignor's Interest

Recorded: 2004-09-22 Pages: 2
Assignors
OSANAI, HIDEYO
Executed: 2004-09-07
NAMIOKA, MAKOTO
Executed: 2004-09-07
IBARAKI, SUSUMU
Executed: 2004-09-07
Assignee
DOWA MINING CO., LTD.
8-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO 100-8282, JAPAN
Covered Property (1)
Method for Producing Metal/Ceramic Bonding Circuit Board
Patent: 7,340,828 →
Application: 10/948,695 →
Publication: US 2005/0060887
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 5, 2007
From: DOWA MINING CO., LTD.
To: DOWA HOLDINGS CO., LTD.
Reel/Frame 020121/0161 →
Assignment of Assignor's Interest Jan 11, 2008
From: DOWA HOLDINGS CO., LTD.
To: DOWA METALTECH CO., LTD.
Reel/Frame 020354/0632 →