Silver particle powder and method of manufacturing same
View Patent ↗A fine silver particle powder is provided that is a suitable material for interconnects used to form fine circuit patterns especially by the inkjet method, and a method of manufacturing the powder. Although the powder is fine and therefore has a large specific surface area, it has good weatherability and corrosion resistance. The powder particles have a calculated specific surface area (CS) of 50 m 2 /cm 3 or more, an X-ray crystal grain diameter (D X ) of not more than 50 nm, not more than 10.0 basicity points/nm 2 and not more than 10.0 acidity points/nm 2 . To obtain the silver particle powder, a silver compound is reduced in an organic solvent, using as the reducing agent one, two or more selected from an alcohol or polyol. The reduction reaction proceeds in the presence of an organic protective agent and a polarity inhibition agent.
1. A silver particle powder having a calculated specific surface area (CS) of 50 m 2 /cm 3 or more, an X-ray crystal grain diameter (D x ) of not more than 50 nm, not more than 10.0 basicity points/nm 2 and not more than 10.0 acidity points/nm 2 .
2. A silver particle powder according to claim 1 , wherein to the particle surface of which is adhered an organic protective agent that is an amino compound having a molecular weight of from 100 to 1000.
3. A silver particle disperse system constituted by the dispersion of the silver particle powder according to claim 1 , in a non-polar or low-polarity organic dispersion medium, wherein average particle diameter (D 50 ) measured by a dynamic light-scattering method is not more than 100 nm and degree of dispersion (D 50 )/(D TEM ) is not more than 5.0.
4. The silver particle powder according to claim 2 , wherein the organic protective agent is oleyl amine.
5. A silver particle disperse system constituted by the dispersion of the silver particle powder according to claim 2 , in a non-polar or low-polarity organic dispersion medium, wherein average particle diameter (D 50 ) measured by a dynamic light-scattering method is not more than 100 nm and degree of dispersion (D 50 )/(D TEM ) is not more than 5.0.