IP Library Patent Application 11355888
Patent Application
App. No. 11/355,888

Copper powder

Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US None
App. No.
11/355,888
Abstract

A copper powder that is excellent in weatherability and adapted for use in conductive paste is provided that contains 10-20,000 ppm, preferably 100-2,000 ppm, of Sn. The copper powder is particularly preferably one having an average particle diameter DM of 0.1-2 μm and, further, one wherein the particle diameter of at least 80% of all particles is in the range of 0.5 D M -1.5 D M . This copper powder can be produced, for example, by precipitating Cu metal by reduction of Cu ions in the presence of Sn ions.

Claims (16)

1 . A copper powder containing 10-20,000 ppm of Sn.

2 . A copper powder containing 100-2,000 ppm of Sn.

3 . A copper powder according to claim 1 , whose average particle diameter DM is 0.1-2 μm.

4 . A copper powder according to claim 1 , whose average particle diameter DM is 0.1-2 μm and wherein the particle diameter of at least 80% of all particles is in the range of 0.5 DM-1.5 DM.

5 . A copper powder according to claim 1 , obtained by precipitating copper metal by reduction of Cu ions in the presence of Sn ions.

6 . A copper powder according to claim 1 , obtained by precipitating copper metal by reduction of cuprous oxide containing 10-1,000 ppm of Sn.

7 . A copper powder suitable for use as filler in a conductive paste, containing 10-20,000 ppm of Sn, whose average particle diameter DM is 0.1-2 μm and the particle diameter of at least 80% of all particles is in the range of 0.5 DM-1.5 DM.

8 . A copper powder according to claim 2 , whose average particle diameter DM is 0.1-2 μm.

9 . A copper powder according to claim 2 , whose average particle diameter DM is 0.1-2 μm and wherein the particle diameter of at least 80% of all particles is in the range of 0.5 DM-1.5 DM.

10 . A copper powder according to claim 3 , whose average particle diameter DM is 0.1-2 μm and wherein the particle diameter of at least 80% of all particles is in the range of 0.5 DM-1.5 DM.

11 . A copper powder according to claim 2 , obtained by precipitating copper metal by reduction of Cu ions in the presence of Sn ions.

12 . A copper powder according to claim 3 , obtained by precipitating copper metal by reduction of Cu ions in the presence of Sn ions.

13 . A copper powder according to claim 4 , obtained by precipitating copper metal by reduction of Cu ions in the presence of Sn ions.

14 . A copper powder according to claim 2 , obtained by precipitating copper metal by reduction of cuprous oxide containing 10-1,000 ppm of Sn.

15 . A copper powder according to claim 3 , obtained by precipitating copper metal by reduction of cuprous oxide containing 10-1,000 ppm of Sn.

16 . A copper powder according to claim 4 , obtained by precipitating copper metal by reduction of cuprous oxide containing 10-1,000 ppm of Sn.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 7, 2008
From: DOWA HOLDINGS CO., LTD.
To: DOWA ELECTRONICS MATERIALS CO., LTD.
Reel/Frame 020323/0715 →
CHANGE OF NAME Recorded Nov 5, 2007
From: DOWA MINING CO., LTD.
To: DOWA HOLDINGS CO., LTD.
Reel/Frame 020121/0161 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 22, 2006
From: YAMADA, TOMOYA; HIRATA, KOJI
To: DOWA MINING CO., LTD.
Reel/Frame 017655/0024 →