Circuit board and semiconductor device
View Patent ↗A semiconductor device, includes: a semiconductor substrate; a multilayered interconnect structure formed on the semiconductor substrate; a terminal for flip-chip packaging arranged on the surface of the multilayered interconnect structure; and a spiral inductor formed to enclose the terminal for flip-chip packaging, in a plan view, which is not electrically connected with the spiral inductor. The spiral inductor may be provided for peaking by which the gain reduction caused in a high frequency is compensated.
1. A semiconductor device, comprising:
a semiconductor substrate;
a multilayered interconnect structure formed on said semiconductor substrate;
a terminal for flip-chip packaging arranged on the surface of said multilayered interconnect structure; and
a spiral inductor formed to enclose said terminal for flip-chip packaging, in a plan view, which is not electrically connected with said spiral inductor.
2. The semiconductor device according to claim 1 ,
wherein said spiral inductor and terminal for flip-chip packaging are formed in different layers of said multilayered interconnect structure with each other.
3. The semiconductor device according to claim 1 ,
wherein said spiral inductor is formed over a plurality of layers of said multilayered interconnect structure.
4. The semiconductor device according to claim 2 ,
wherein said spiral inductor is formed over a plurality of layers of said multilayered interconnect structure.
5. The semiconductor device according to claim 1 , further comprising a resistance, said spiral inductor being connected to said resistance.
6. The semiconductor device according to claim 2 , further comprising a resistance, said spiral inductor being connected to said resistance.
7. The semiconductor device according to claim 1 ,
wherein said spiral inductor is provided for peaking by which the gain reduction caused in a high frequency is compensated.
8. The semiconductor device according to claim 2 ,
wherein said spiral inductor is provided for peaking by which the gain reduction caused in a high frequency is compensated.
9. The semiconductor device according to claim 1 ,
wherein said terminal for flip-chip packaging is connected to a connection structure including a plurality of interconnects and vias alternately connected with each other and formed over a plurality of layers of said multilayered interconnect structure.
10. The semiconductor device according to claim 2 ,
wherein said terminal for flip-chip packaging is connected to a connection structure including a plurality of interconnects and vias alternately connected with each other and formed over a plurality of layers of said multilayered interconnect structure.
11. A circuit board, comprising:
a substrate;
a terminal for flip-chip packaging arranged on the surface of said substrate; and
a spiral inductor formed to enclose said terminal for flip-chip packaging, in a plan view, which is not electrically connected with said spiral inductor.
12. The circuit board according to claim 11 , further comprising a plurality of terminals for flip-chip packaging including said terminal for flip-chip packaging which is enclosed by said spiral inductor, wherein said plurality of terminals for flip-chip packaging are arranged on the surface of said substrate in a plan view.
13. The circuit board according to claim 12 , further comprising a plurality of spiral inductors formed so that each of said plurality of spiral inductors encloses at least one of said terminals for flip-chip packaging in a plan view.
14. The circuit board according to claims 11 ,
said spiral inductor is provided for peaking by which the gain reduction caused in a high frequency is compensated.
15. The circuit board according to claims 12 ,
said spiral inductor is provided for peaking by which the gain reduction caused in a high frequency is compensated.
16. The circuit board according to claims 13 ,
said spiral inductor is provided for peaking by which the gain reduction caused in a high frequency is compensated.
17. The circuit board according to claim 11 , wherein a plurality of through electrodes are provided in said substrate and one end of each of which is serves as said terminal for flip-chip packaging, said spiral inductor being connected to one of said through electrodes.
18. A semiconductor device, comprising:
a semiconductor substrate;
a first multilayered interconnect structure formed on said semiconductor substrate;
a terminal for flip-chip packaging arranged on the surface of, and electrically connected to, said first multilayered interconnect structure; and
a spiral inductor formed to enclose said terminal for flip-chip packaging, in a plan view, said spiral inductor not being electrically connected to said terminal and said first multilayered interconnect structure.
19. The semiconductor device according to claim 18 , wherein said spiral inductor is formed over, and electrically connected to, a second multilayered interconnect structure that is not electrically connected to said first multilayered interconnect structure.
20. The semiconductor device according to claim 19 , further comprising a resistance, said spiral inductor being connected to said resistance through said second multilayered interconnect structure.