IP Library Granted Patent US 7,687,383
Granted Patent B2
US 7,687,383 · App. 11/343,244 · Granted Mar 30, 2010

Methods of depositing electrically active doped crystalline Si-containing films

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Quick Facts
Patent No.
US 7,687,383
App. No.
11/343,244
Granted
Mar 30, 2010
Kind
B2
Abstract

Methods of making Si-containing films that contain relatively high levels of Group III or Group V dopants involve chemical vapor deposition using trisilane and a dopant precursor. Extremely high levels of substitutional incorporation may be obtained, including crystalline silicon films that contain at least about 3×10 20 atoms cm −3 of an electrically active dopant. Substitutionally doped Si-containing films may be selectively deposited onto the crystalline surfaces of mixed substrates by introducing an etchant gas during deposition.

Claims (29)

1. A method of depositing a doped crystalline Si-containing film, comprising:

providing a substrate disposed within a chamber;

intermixing trisilane and a dopant precursor to form a feed gas, the dopant precursor comprising an electrical dopant;

contacting the substrate with the feed gas under chemical vapor deposition conditions; and

depositing a doped crystalline Si-containing film onto the substrate at a deposition rate of at least about 10 nm per minute, the doped crystalline Si-containing film having an as-deposited resistivity of about 1.0 mΩ·cm or less prior to any activation anneal, wherein the doped crystalline Si-containing film contains less than about 3×10 19 atoms cm −3 of an electrically inactive dopant.

2. The method of claim 1 , wherein the electrical dopant is an n-type dopant.

3. The method of claim 2 , wherein the electrical dopant comprises arsenic.

4. The method of claim 2 , wherein the electrical dopant comprises phosphorous.

5. The method of claim 1 , wherein the electrical dopant is a p-type dopant.

6. The method of claim 5 , wherein the electrical dopant comprises boron.

7. The method of claim 1 , further comprising intermixing a carbon source with the trisilane and the dopant precursor to form the feed gas.

8. The method of claim 7 , wherein the carbon source is selected from the group consisting of monosilylmethane, disilylmethane, trisilylmethane, tetrasilylmethane, monomethyl silane, dimethyl silane and 1,3-disilabutane.

9. The method of claim 7 , wherein the carbon source comprises monomethylsilane and the dopant precursor comprises arsenic.

10. The method of claims 7 , wherein the carbon source comprises monomethylsilane and the dopant precursor comprises phosphorous.

11. The method of claim 1 , further comprising intermixing a germanium source with the trisilane and the dopant precursor to form the feed gas.

12. The method of claim 11 , wherein the germanium source comprises germane.

13. The method of claim 1 , wherein the deposition rate is at least about 20 nm per minute.

14. The method of claim 1 , further comprising introducing the feed gas to the chamber.

15. The method of claim 1 , wherein the doped crystalline Si-containing film comprises at least about 3×10 20 atoms cm −3 of the electrical dopant.

16. The method of claim 1 , wherein the doped crystalline Si-containing film comprises at least about 4×10 20 atoms cm −3 of the electrical dopant.

17. The method of claim 1 , wherein the doped crystalline Si-containing film contains less than about 5×10 20 atoms cm −3 of an electrical dopant.

18. The method of claim 1 , wherein the doped crystalline Si-containing film contains less than about 2×10 19 atoms cm −3 of an electrical inactive dopant.

19. The method of claim 1 , wherein the doped crystalline Si-containing film contains less than about 1×10 19 atoms cm −3 of an electrically inactive dopant.

20. The method of claim 1 , wherein the doped crystalline Si-containing film has a resistivity of about 0.7 mΩ·cm or less.

21. The method of claim 1 , wherein the doped crystalline Si-containing film has a resistivity of about 0.5 mΩ·cm or less.

22. The method of claim 1 , wherein the doped crystalline Si-containing film has a resistivity of about 0.4 mΩ·cm or less.

23. The method of claim 1 , wherein the dopant precursor comprises a dopant hydride.

24. The method of claim 23 , wherein the dopant hydride is a p-type dopant hydride selected from diborane or deuterated diborane.

25. The method of claim 23 , wherein the dopant hydride is a n-type dopant hydride selected from phosphine, arsenic vapor or arsine.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 4, 2021
From: ASM AMERICA, INC.
To: ASM IP HOLDING B.V.
Reel/Frame 056465/0280 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 24, 2006
From: BAUER, MATTHIAS
To: ASM AMERICA, INC.
Reel/Frame 017680/0387 →