Direct impingement cooling of a laser diode array

1. A laser diode array assembly, comprising:

an array of vertical emitting laser diodes coupled to a substrate, said vertical emitting laser diodes each having a vertical emitting surface and an exposed substrate surface;

at least one nozzle that sprays a fluid onto said exposed substrate surfaces; and,

a mounting fixture attached to said array of vertical emitting laser diodes in a manner that allows laser beams to be emitted from said vertical emitting surfaces and said fluid to be sprayed directly on said exposed substrate surfaces of said vertical emitting laser diodes.

2. The assembly of claim 1 , further comprising a mounting fixture attached to said substrate.

3. The assembly of claim 1 , wherein said substrate has a plurality of apertures.

4. The assembly of claim 1 , wherein said nozzle emits a liquid spray.

5. The assembly of claim 1 , wherein said substrate is transparent to a plurality of beams of light emitted by said vertical emitting laser diodes.

6. A method for operating an array of laser diodes, comprising:

generating a plurality of laser beams from a plurality of vertical emitting surfaces of a plurality of vertical emitting laser diodes, the vertical emitting laser diodes each having an exposed substrate surface and a mounting fixture is attached to the array of vertically emitting laser diodes in a manner that allows laser beams to be emitted from said vertical emitting surfaces and said fluid to be sprayed directly on said exposed substrate surfaces of said vertical emitting laser diodes,

spraying the exposed substrate surfaces with a fluid spray.

7. The method of claim 6 , wherein the fluid spray is a liquid spray.

8. The method of claim 6 , wherein the laser beams travel through apertures in a substrate of the vertical emitting laser diodes.

9. The method of claim 6 , wherein the laser beams travel through a transparent substrate of the vertical emitting laser diodes.