Semiconductor chip and method of fabricating the same
View Patent ↗There is provided a semiconductor chip having fuses. The semiconductor chip includes fuses each having a first terminal electrically connected to a first logic circuit, a second terminal electrically connected to a second logic circuit, and a blowable region formed between the first terminal and the second terminal; and fuse residues each having the same patterns with those of the first terminal and the second terminal of the fuses, and configured so that patterns corresponded to the first terminals and the second terminals are electrically disconnected from each other.
1. A method of fabricating semiconductor chips by forming fuses with a mask having a plurality of fuse patterns formed thereon, comprising:
forming a plurality of fuses on a first semiconductor substrate using a first fuse-forming mask;
from among the plurality of fuses on said first semiconductor substrate, identifying a fuse to be blown that is common to each of a plurality of second semiconductor substrates;
producing a second fuse-forming mask having a plurality of fuse patterns corresponding to said plurality of fuses except said fuse to be blown, said second fuse-forming mask having a fuse residue pattern which includes only an incomplete part of a fuse pattern at a site corresponding to said fuse to be blown; and
on each of said second semiconductor substrates, forming said plurality of fuses and said part of a fuse pattern using said second fuse-forming mask.