Light emitting device package
View Patent ↗A light emitting device package is provided. The light emitting device package includes a light emitting device; a package body on which the light emitting device is loaded and which dissipates heat generated from the light emitting device to the outside; a first electrode formed in the package body in a single body; and a second electrode inserted into the package body.
1. A light emitting device package comprising:
a light emitting device;
a package body on which the light emitting device is loaded and which dissipates heat generated from the light emitting device to the outside;
a first electrode formed in the package body in a single body; and
a second electrode inserted into the package body,
wherein a cavity is formed in the upper portion of the package body, and the light emitting device is loaded on the bottom surface of the cavity,
wherein a first groove is formed in a predetermined shape corresponding to the loaded light emitting device in the bottom surface of the cavity, and
wherein a second groove is formed in a predetermined shape in the upper surface of the cavity body outside the cavity.
2. The light emitting device package of claim 1 , wherein the package body is formed of a metal.
3. The light emitting device package of claim 2 , wherein the package body is formed of copper (Cu), copper (Cu) alloy, aluminum (Al) or aluminum (Al) alloy.
4. The light emitting device package of claim 3 , wherein the package body is formed of oxygen free high conductivity (OFHC) Cu or copper-tungsten (Cu—W) alloy.
5. The light emitting device package of claim 1 , wherein the second electrode is formed of OFHC Cu, Cu alloy, Al, Al alloy or KOVAR alloy.
6. The light emitting device package of claim 1 , wherein the second electrode passes through the package body and an end portion thereof is exposed from the bottom surface or the lateral of the cavity.
7. The light emitting device package of claim 6 , wherein an insulating material is interposed between the second electrode and the package body.
8. The light emitting device package of claim 7 , wherein the insulating material is a ceramic or glass.
9. The light emitting device package of claim 1 , wherein a reflection coating layer is formed on the entire surface of the package body.
10. The light emitting device package of claim 9 , wherein the reflection coating layer is formed of silver (Ag) or Al.
11. The light emitting device package of claim 1 , wherein a reflection coating layer is formed on the lateral portion and the bottom surface of the cavity.
12. The light emitting device package of claim 11 , wherein the reflection coating layer is formed of Ag or Al.
13. A light emitting device package comprising:
a light emitting device;
a package body in which a cavity is formed in its upper portion where the light emitting device is loaded on a bottom surface of the cavity and a lateral portion of the cavity has a concave rounded shape;
a first electrode formed in a single body of the package body; and
a second electrode inserted in the package body,
wherein a first groove corresponding to the shape of the loaded light emitting device is formed on the bottom surface of the cavity, and
wherein a second groove is formed in a predetermined shape in the upper surface of the cavity body outside the cavity.
14. The light emitting device of claim 13 , wherein the package body is formed of metal.
15. The light emitting device of claim 14 , wherein the package body is formed of Cu, Cu alloy, Al or Al alloy.
16. The light emitting device f claim 14 , wherein the package body is formed of OFHC Cu or Cu—W alloy.
17. The light emitting device of claim 13 , wherein the second electrode is formed of OFHC Cu, Cu alloy, Al, Al alloy or KOVAR alloy.
18. The light emitting device package of claim 13 , wherein the second electrode passes through the package body and an end portion thereof is exposed from the bottom surface or the lateral portion of the cavity.
19. The light emitting device package of claim 18 , wherein an insulating material is interposed between the second electrode and the package body.
20. The light emitting device package of claim 19 , wherein the insulating material is a ceramic or glass.
21. The light emitting device package of claim 13 , wherein a reflection coating layer is formed on the entire surface of the package body.
22. The light emitting device package of claim 21 , wherein the reflection coating layer is formed of Ag or Al.
23. The light emitting device package of claim 13 , wherein a reflection coating layer is formed on the lateral portion and the bottom surface of the cavity.
24. The light emitting device package of claim 23 , wherein the reflection coating layer is formed of Ag or Al.