IP Library Granted Patent US 7,554,130
Granted Patent B1
US 7,554,130 · App. 11/361,869 · Granted Jun 30, 2009

Reducing effects of parasitic transistors in thyristor-based memory using an isolation or damage region

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Quick Facts
Patent No.
US 7,554,130
App. No.
11/361,869
Granted
Jun 30, 2009
Kind
B1
Abstract

An integrated circuit having memory, including thyristor-based memory cells, is described, where each of the thyristor-based memory cells includes a thyristor-based storage element and an access transistor. Where the thyristor-based storage element includes an anode region and a cathode region, a pair of the thyristor-based memory cells are commonly coupled via a bitline associated with the access transistor or via a reference voltage line coupled to the anode region. Bitline or anode regions are separated from one another by an isolation region. In another configuration, a bitline region has a locally implant-damaged region to inhibit charge transfer between the pair. In yet another configuration, a storage node contact or contacts respectively can extend over or are coupled to a storage node line extending over an isolation region. In this latter configuration, a source/drain region and the cathode region are separated from one another by an isolation region.

Claims (11)

1. An integrated circuit having memory, comprising:

thyristor-based memory cells, each of the thyristor-based memory cells including a thyristor-based storage element and an access transistor, the thyristor-based storage element including an anode region and a cathode region;

a pair of the thyristor-based memory cells commonly coupled via a bitline region associated with the access transistor;

the pair of the thyristor-based memory cells defining a parasitic bipolar junction transistor therebetween responsive to the bitline region being common;

the bitline region having a locally implant-damaged region to inhibit charge transfer between the pair of the thyristor-based memory cells via the parasitic bipolar junction transistor;

the locally implant-damaged region extending to and in contact with an insulator layer of a silicon-on-insulator wafer on which the integrated circuit is formed; and

the locally implant-damaged region formed with lateral control for at least some separation from p-n junctions of the bitline region.

2. The integrated circuit according to claim 1 , wherein the bitline region includes a portion on each side of the locally implant-damaged region to provide a source/drain region for the access transistor of each thyristor-based memory cell of the pair.

3. The integrated circuit according to claim 2 , wherein the locally implant-damaged region is formed using an implant angle in a range of approximately perpendicular to 45 degrees from a top surface of the silicon-on-insulator wafer.

4. The integrated circuit according to claim 1 , wherein the locally implant-damaged region is formed by implanting heavy ions having an atomic mass of at least 28 atomic mass units.

5. The integrated circuit according to claim 4 , wherein the heavy ions are part of a cluster or compound.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 21, 2013
From: T-RAM SEMICONDUCTOR, INC.
To: T-RAM (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 031694/0018 →
PURCHASE OPTION AGREEMENT Recorded Jun 3, 2010
From: T-RAM SEMICONDUCTOR, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 024474/0979 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 23, 2006
From: ROBINS, SCOTT; NEMATI, FARID; YANG, KEVIN J.; ERSHOV, MAXIM; GUPTA, RAJESH N.; BANNA, SRINIVASA R.
To: T-RAM SEMICONDUCTOR, INC.
Reel/Frame 017628/0663 →