Fiber optic transceiver module with electromagnetic interference absorbing material and method for making the module
View Patent ↗A fiber optic module and method for making the module uses an electromagnetic interference (EMI) absorbing material, which is positioned within an interior region defined by a housing of the module. The EMI absorbing material has electrical properties to absorb electromagnetic radiation to reduce EMI emissions of the module.
1. A fiber optic module comprising:
a housing configured to provide an interior region defined by said housing;
a printed circuit board positioned within said interior region provided by said housing, said printed circuit board including a major surface onto which a majority of electrical components are mounted and a minor surface opposite of said major surface;
an optoelectronic device electrically connected to said printed circuit board; and
an electromagnetic interference absorbing material positioned within said interior region provided by said housing, said electromagnetic interference absorbing material being exclusively positioned directly next to a side of said housing between said minor surface of said printed circuit board and said side of said housing, said electromagnetic interference absorbing material having electrical properties to absorb electromagnetic radiation to reduce electromagnetic interference emissions of said module.
2. The module of claim 1 wherein said electromagnetic interference absorbing material is configured as a layer of said electromagnetic interference absorbing material.
3. The module of claim 1 wherein said electromagnetic interference absorbing material includes a room temperature vulcanizing silicone rubber material having microwave absorbing properties.
4. The module of claim 1 wherein said electromagnetic interference absorbing material is configured as a sheet of said electromagnetic interference absorbing material.
5. The module of claim 1 wherein said electromagnetic interference absorbing material includes a magnetically loaded epoxide material having microwave absorbing properties.
6. The module of claim 1 further comprising a transmit optical sub-assembly electrically connected to said printed circuit board.
7. The module of claim 1 further comprising a receive optical sub-assembly electrically connected to said printed circuit board.
8. The module of claim 1 further comprising a connector interface structure attached to said housing, said connector interface structure being configured to interface with a fiber optic cable.
9. The module of claim 1 wherein said housing substantially conforms to the Multi Source Agreement for Small Form Factor Pluggable (SFP) transceivers.
10. A fiber optic transceiver module comprising:
a housing configured to provide an interior region defined by said housing;
a printed circuit board positioned within said interior region provided by said housing, said printed circuit board including a major surface onto which a majority of electrical components are mounted and a minor surface opposite of said major surface;
a transmit optical subassembly electrically connected to said printed circuit board;
a receive optical subassembly electrically connected to said printed circuit board; and
an electromagnetic interference absorbing material positioned within said interior region provided by said housing, said electromagnetic interference absorbing material being exclusively positioned directly next to a side of said housing between said minor surface of said printed circuit board and said side of said housing, said electromagnetic interference absorbing material having electrical properties to absorb electromagnetic radiation to reduce electromagnetic interference emissions of said module.
11. The module of claim 10 wherein said electromagnetic interference absorbing material is configured as a layer of said electromagnetic interference absorbing material.
12. The module of claim 10 wherein said electromagnetic interference absorbing material includes a room temperature vulcanizing silicone rubber material having microwave absorbing properties.
13. The module of claim 10 wherein said electromagnetic interference absorbing material is configured as a sheet of said electromagnetic interference absorbing material.
14. The module of claim 10 wherein said electromagnetic inference absorbing material includes a magnetically loaded epoxide material having microwave absorbing properties.
15. A method for making a fiber optic module, said method comprising:
providing a housing of said module, said housing being configured to provide an interior region defined by said housing;
providing a printed circuit board, said printed circuit board including a major surface onto which a majority of electrical components are mounted and a minor surface opposite of said major surface;
providing an optoelectronic device;
providing an electromagnetic interference absorbing material, said electromagnetic interference absorbing material having electrical properties to absorb electromagnetic radiation; and
assembling said housing, said printed circuit board, said optoelectronic device and said electromagnetic interference absorbing material to produce said module, including positioning said electromagnetic interference absorbing material within said interior region provided by said housing to reduce electromagnetic interference emissions of said module, said electromagnetic interference absorbing material being exclusively positioned directly next to a side of said housing between said minor surface of said printed circuit board and said side of said housing.
16. The method of claim 15 wherein said electromagnetic interference absorbing material includes a room temperature vulcanizing silicone rubber material having microwave absorbing properties.
17. The method of claim 15 wherein said electromagnetic interference absorbing material includes a magnetically loaded epoxide material having microwave absorbing properties.