Carbon nanotube deposition with a stencil
Composition of carbon nanotubes (CNTs) are produced into inks that are dispensable via printing or stencil printing processes. The CNT ink is dispensed into wells formed in a cathode structure through a stencil.
1. A process for producing a field emission cathode comprising the steps of:
providing a substrate having a plurality of wells physically separated from each other by walls;
positioning a stencil with holes therein over the substrate, each of the holes positioned over one of the plurality of wells; and
depositing a CNT mixture through the holes onto the substrate into each of the plurality of wells so that the CNT mixture fills each well so as to be touching each wall defining the well.
2. The process as recited in claim 1 , wherein the CNT mixture is a CNT ink.
3. The process as recited in claim 1 , wherein the CNT mixture is a CNT paste.
4. The process as recited in claim 1 , further comprising the step of removing the stencil after the depositing step.
5. The process as recited in claim 1 , wherein the CNT mixture is deposited onto a conductive layer deposited over the substrate.
6. The process as recited in claim 1 , wherein the stencil comprises a stainless steel sheet with a pattern of openings formed there-through.
7. The process as recited in claim 6 , wherein the stainless steel sheet is between 30 micrometers and 150 micrometers thick.
8. The process as recited in claim 2 , wherein a viscosity of the CNT ink is between 8,000 centipoises and 100,000 centipoises.
9. The process as recited in claim 2 , wherein the CNT ink comprises CNT powders and Resbond 989.
10. The process as recited in claim 1 , wherein the CNT mixture comprises CNT powders, vehicle organics, and glass frit.
11. The process as recited in claim 1 , wherein the CNT mixture comprises CNT powders, aluminum oxide nanoparticles, and thinner.
12. A process for producing a display comprising the steps of:
providing a substrate having a plurality of wells physically separated from each other by walls;
making a cathode, further comprising the steps of:
positioning a stencil with holes therein over the substrate, each of the holes positioned over one of the plurality of wells; and
depositing a CNT mixture through the holes onto the into each of the plurality of wells so that the CNT mixture fills each well so as to be touching each wall defining the well; and
positioning the cathode a distance from an anode comprising a phosphor on a substrate.
13. The process as recited in claim 12 , wherein the CNT mixture is a CNT ink.
14. The process as recited in claim 12 , wherein the CNT mixture is a CNT paste.
15. The process as recited in claim 12 , further comprising the step of removing the stencil after the depositing step.
16. The process as recited in claim 12 , wherein the CNT mixture is deposited onto a conductive layer deposited over the substrate.
17. The process as recited in claim 12 , wherein the stencil comprises a stainless steel sheet with a pattern of openings formed there-through.
18. The process as recited in claim 17 , wherein the stainless steel sheet is between 30 micrometers and 150 micrometers thick.
19. The process as recited in claim 13 , wherein a viscosity of the CNT ink is between 8,000 centipoises and 100,000 centipoises.
20. The process as recited in claim 13 , wherein the CNT ink comprises CNT powders and Resbond 989.
21. The process as recited in claim 12 , wherein the CNT mixture comprises CNT powders, vehicle organics, and glass frit.
22. The process as recited in claim 12 , wherein the CNT mixture comprises CNT powders, aluminum oxide nanoparticles, and thinner.