Method for inspecting a region of interest
View Patent ↗An inspection method utilizing vertical slice imaging. A number of horizontal slice images, extending through an object of interest, are acquired. A vertical region of interest is defined from the data representing the horizontal slice images. A vertical slice image is constructed based upon the horizontal slice image data falling within the vertical region of interest. The vertical slice image data may be analyzed to detect defects. In addition, a method is provided to detect defects in a BGA joint. The method includes locating a center of the joint. The method may further include measuring a number of diameters through the center of the joint and applying a rule to compare the measured diameters to an expected diameter.
1. A method for inspecting a region of interest, comprising:
acquiring data corresponding to a number of horizontal slice images extending through an object of interest;
locating a horizontal slice image from the number of horizontal slice images, the locating step comprising:
computing, for at least two of the horizontal slice images, an amount of solder within each of the at least two horizontal slice images;
reviewing a distribution of the computed amounts of solder; and
based on the review, locating the horizontal slice at a desired position for analyzing a characteristic of the region of interest; and
analyzing the located horizontal slice image for the characteristic, wherein the following equation is used to calculate the amount of solder:
∑
gray
=
0
bgd_gray
(
background_gray
-
gray
)
*
histogram
[
gray
]
.
2. The method of claim 1 , wherein the characteristic is a defect.
3. The method of claim 1 , wherein the characteristic is a pad/lead interface.
4. The method of claim 1 , further comprising synthesizing a vertical slice based on the located horizontal slice.
5. The method of claim 1 , wherein the step of computing an amount of solder comprises computing a weighted summation of gray scale data points over a gray scale histogram.
6. The method of claim 1 , further comprising selecting the at least two horizontal slice images in accordance with the sampling theorem.
7. The method of claim 1 , wherein the object of interest comprises a ball grid array joint comprising a solder ball, and the located horizontal slice represents a horizontal slice passing through the approximate center of the solder ball.
8. The method of claim 1 , wherein the step of locating comprises identifying a first peak in the distribution.
9. The method of claim 1 , wherein the step of locating comprises determining a most significant peak in the distribution, applying an algorithm to the most significant peak and at least one other point in the distribution, and locating a slice other than a slice associated with the most significant peak.
10. The method of claim 1 , wherein the step of locating comprises identifying a noise level and locating a slice having a solder amount which falls below the noise level.
11. The method of claim 1 , wherein the step of locating comprises identifying unobstructed anchor devices.
12. The method of claim 1 , wherein the data is acquired using tomosynthesis.
13. A method for inspecting a region of interest, comprising:
acquiring data corresponding to a number of horizontal slice images extending through an object of interest;
locating a horizontal slice image from the number of horizontal slice images, the locating step comprising:
computing, for at least two of the horizontal slice images, an amount of solder within each of the at least two horizontal slice images;
determining a most significant peak in the distribution;
applying an algorithm to the most significant peak and at least one other point in the distribution; and
locating a horizontal slice other than a horizontal slice associated with the most significant peak as the horizontal slice at a desired position for analyzing a characteristic of the region of interest; and
analyzing the located horizontal slice image for the characteristic.
14. A method for inspecting a region of interest, comprising:
acquiring data corresponding to a number of horizontal slice images extending through an object of interest;
locating a horizontal slice image from the number of horizontal slice images, the locating step comprising:
computing, for at least two of the horizontal slice images, an amount of solder within each of the at least two horizontal slice images;
reviewing a distribution of the computed amounts of solder;
identifying a noise level; and
locating a slice having a solder amount which falls below the noise level as the horizontal slice at a desired position for analyzing a characteristic of the region of interest; and
analyzing the located horizontal slice image for the characteristic.