Semiconductor carrier tray, and burn-in board, burn-in test method, and semiconductor manufacturing method using the semiconductor carrier tray
By mounting a semiconductor carrier tray in an accommodating portion of a housing of a burn-in board and then closing a lid member, a large number of semiconductors can be placed on the burn-in board. By putting the burn-in board in this state into a burn-in tester, the plurality of semiconductors can be collectively tested. Accordingly, the semiconductors and sockets for holding the semiconductors need not be provided in the one-to-one relation, whereby a larger number of semiconductors can be tested at once.
1. A burn-in board comprising: a semiconductor carrier tray having a large number of receiving portions arranged in a planar matrix form, for placing and retaining semiconductors thereon; a base substrate having a large number of elastic contacts arranged on a surface of the substrate; a relay substrate having a large number of elastic contacts provided on, from among both front and back surfaces thereof, at least the front surface, the relay substrate being arranged on the base substrate; and a lid member arranged so as to be opposed to the base substrate, wherein the semiconductor carrier tray is detachably provided between the relay substrate and the lid member.
2. The burn-in board according to claim 1 , further comprising: a housing provided on the base substrate, the housing having an accommodating portion accommodating one or both of the relay substrate and the semiconductor carrier tray.
3. The burn-in board according to claim 1 , wherein the elastic contacts are symmetrically provided on both front and back surfaces of the relay substrate.
4. The burn-in board according to claim 1 , wherein the relay substrate is detachably provided.
5. The burn-in board according to claim 1 , wherein segmented small relay substrates are provided on the base substrate on a per-block basis.